Going off-topic, does Mickey Mouse enter public domain in 2023?Copyrights should be substantially shorter than they are today, but they were contorted because of megacorporations like Disney.
Follow along with the video below to see how to install our site as a web app on your home screen.
Note: This feature may not be available in some browsers.
Going off-topic, does Mickey Mouse enter public domain in 2023?Copyrights should be substantially shorter than they are today, but they were contorted because of megacorporations like Disney.
In Sweden, we have the equivalent of design patents, but it's not called a patent. There's undoubtedly other differences as well of course, like any two similar laws would tend to differ between nations...Design patents are a bit strange.
That diagram looks more or less like a 2S Epyc fully scaled out. Current designs feature 128M of cache and it's not inconceivable the 7nm Epycs could double that. That configuration is 8x16 PCIe lanes in theory all working as Infinity Fabric for added bandwidth. I don't believe there is an interconnect chip, but actual CPUs serving that functionality. That would provide direct access to system memory for the GPUs which is the design goal with HBM/HBCC serving as a LLC for each GPU.I think AMD is working on implementing their exascale apu architecture with vega 20 as outlined by AMD Research in their paper.
It looks like EPYC seems to be following along with this design. There are rumors that it will have a 5th chip which will be the interconnect between CPUs and GPUs and will have 256M of cache and interfaces to I/O and memory. The CPUs will be chiplets with small caches and high speed interfaces to the interconnect chip. This rumor mirrors the diagram below from the research paper.
It is possible that vega 20 might be the a chiplet as well although I doubt it because the EPYC package is too small and the heat would cause issues. I think it is still most likely going to remain a PCI 4.0 device for now.
http://www.computermachines.org/joe/publications/pdfs/hpca2017_exascale_apu.pdf
Looking at AMD's recent patent applications you can clearly see that they are all about cache and coordinating cache between multiple devices and offloading memory operations.
The chiplet concept in that concept paper differs from the implementation of Summit Ridge. A chiplet in that case is a silicon chip that cannot function independently of an active interposer underneath it. The various Zen products are composed of one or more x86 SoCs that are fully capable of working on their own and interfacing with the system.I think AMD is working on implementing their exascale apu architecture with vega 20 as outlined by AMD Research in their paper.
It looks like EPYC seems to be following along with this design. There are rumors that it will have a 5th chip which will be the interconnect between CPUs and GPUs and will have 256M of cache and interfaces to I/O and memory. The CPUs will be chiplets with small caches and high speed interfaces to the interconnect chip. This rumor mirrors the diagram below from the research paper.
In Sweden, we have the equivalent of design patents, but it's not called a patent. There's undoubtedly other differences as well of course, like any two similar laws would tend to differ between nations...
One particular weakness with the U.S. patent system seems to be the ability to perpetually extend patent protection by either re-filing the original patent with changes, or filing a new patent with the original patent wording included - I'm not entirely sure which strategy is being used. Maybe both, IANAPL.
Like for instance, this is how Intel is still having control over the x86 architecture, 40 fucking years after its creation.
I would say the closest example would be Power8 and more relevant now Power9 with the on-chip fabric switch and the L3 cache/memory/IO and scaling up/out with SMP.The chiplet concept in that concept paper differs from the implementation of Summit Ridge. A chiplet in that case is a silicon chip that cannot function independently of an active interposer underneath it. The various Zen products are composed of one or more x86 SoCs that are fully capable of working on their own and interfacing with the system.
The HPC concept has CPU and GPU chips that are stripped of a significant amount of ancillary functionality that either goes into neighboring chips/chiplets or is handled by the IO and memory network hosted on the active interposer they are placed on.
I am not sure that there is an upside to having a single central chip hosting the IO and memory interfaces. This would rob AMD's architecture of a key part of its scalability by no longer scaling memory and IO with the area and perimeter of the x86 chips, and instead leaving the central chip's fraction of the total area and perimeter as the upper limit. If it is a separate chip on the package, its perimeter is doing double-duty by hosting more memory and IO than can be fit on a single chip and then the necessary interconnect to allow it to communicate with the x86 chips. The HPC APU concept uses stacking to keep a lot of that connectivity from taking up chip perimeter.
......
Does it have to work to file a patent for it?https://patents.google.com/patent/W...e=Advanced+Micro+Devices+Inc&num=100&sort=new
That's intrinteres! didn't AMD said they have compiler issue's with primitive shadera.
It needs to be “reduced to practice.”Does it have to work to file a patent for it?
I would pick it up , I am very happy with my current vega 56https://www.tomshardware.com/news/amd-earnings-call-tsmc-7nm-gpu,36957.html
Apparently AMD already has 7nm Vega in their lab.
I would pick it up , I am very happy with my current vega 56
It's the Radeon Instinct MI25, so unless you have deep pockets![]()
The Instinct MI25 uses Vega 10, the same GF 14LPP chip as Vega 64/56, Vega FE, etc.It's the Radeon Instinct MI25, so unless you have deep pockets![]()
I'm sure he just meant it's same series as MI25 / replacement for MI25, aka Radeon Instinct top-of-the-lineThe Instinct MI25 uses Vega 10, the same GF 14LPP chip as Vega 64/56, Vega FE, etc.
The card announced here is the 7nm Vega 20 with 4x HBM2 stacks and half-rate FP64.
I would call this confirmation that the first samples are from TSMC (edit: even if I realize that she didn't outright spell it out literally)Also, there's a good chance Vega 20 is being made at TSMC, since they're the ones ramping up 7nm for volume production.
Timothy Arcuri - UBS Securities LLC
I did, yeah. I think you said that the 7-nanometer product is in the lab, and it's going to launch later this year. That's the product at TSMC, correct? And I guess, I'm just wondering on that front do you feel comfortable that you can get capacity from that vendor. Thanks.
Lisa T. Su - Advanced Micro Devices, Inc.
So our foundry strategy is to use both TSMC and GLOBALFOUNDRIES on the first 7-nanometer product. We are using TSMC for that product and we have a very strong relationship with them. And so, we do see a good momentum on it from what we see, and I'm not concerned about capacity.
EPYC actually uses GMI rather than xGMI, so it will probably be different in the details.The earlier slide leaks had Vega 20 featuring xGMI, which is the fabric's protocol extended to run over PCIe interfaces. That's what EPYC does for its dual-socket systems, though how this gets used for GPUs depends on implementation details that have not been leaked.
So AdoredTV claims that he has a source stating there will be dual and triple Vega 7nm cards, and they will use some sort of infinity fabric based interconnect to avoid crossfire.
Rumor is a rumor, but the thought intrigued me.