So, with RDNA2, apparently you can cram 52 CUs (worth 12 TFLOPS) @1,825 GHz into a 360.45 mm² die and have space for an 8-core custom Zen2-CPU?
https://news.xbox.com/en-us/2020/03/16/xbox-series-x-tech/
https://news.xbox.com/en-us/2020/03/16/xbox-series-x-tech/