Xbox One (Durango) Technical hardware investigation

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dragonelite said:
Ekim on gaf posted this.

2YGtW.jpg




All i can see is "204GB/sec peak" bottom center
Click to expand...

109GB/sec (main?)
204GB/s peak BW
4x 256bit read & write.
 
363mm2 die size is barely bigger than Tahiti, but a lot denser. Tahiti is only 4.3B transistors vs 5.5B.

If that SRAM is really dual ported, I bet it accounts for a lot more that ~1.6B transistors.
 
I am assuming that the blue is the cpu, green is the gpu, gray is memory and purple is audio. Purple has a block that looks like its says audio DMA.

Light blue is cpu coherent path while yellow is i/o coherent paths?
 
Jwm said:
Cool it does have 8mb of flash on board as well.

http://semiaccurate.com/2013/08/26/xbox-one-details-in-pictures/

More at link.

Mod edit: Please don't steal other sites' content.
Click to expand...

Thats says 8 GBs of flash.

Temporary VM storage?

Its say eMMC 4.5.

http://www.jedec.org/news/pressreleases/jedec-announces-publication-e-mmc-standard-update-v45

eMMC v4.5 offers performance enhancement features, including an interface bandwidth increase from 104 Mbyte/sec to 200 MByte/sec.
(Im guessing maybe the LZ compression logic plays a part)

The v4.5 standard also adds provision for volatile data cache, which can greatly reduce the latency between data transactions to improve performance.

Reliability enhancements include Power-Off Notification, which makes possible a more robust and safer power-down routine; as well as Dynamic Device Capacity, which provides a mechanism to increase device life time when the e•MMC device has reached its end-of-life, giving the user an opportunity to retrieve critical data from the device before disposal. The standard also adds the capability for the device to retrieve Real-Time Clock information from the host system, which may be used by the device internal memory management to improve data integrity and reliability.

In addition, e•MMC v4.5 provides features to better meet the requirements of the end applications, including enhanced partition attributes for system code and temporary data and separate data removal mechanisms. All performance and reliability enhancements offer designers additional options to improve system performance for the end user.

e•MMC v4.5 continues to support the current e•MMC ballout and adds a second e2MMC ballout that supports the Cache feature and 3 VDDi pins, which support an auxiliary storage medium (DRAM, Phase Change Memory, etc.) in the same device package. This enables manufacturers to fine-tune products by applying the best memory technology for a particular functionality and performance requirement.

About e•MMC
Designed for a wide range of applications in consumer electronics, mobile phones, handheld computers, navigational systems and other industrial uses, e•MMC is an embedded non-volatile memory system, comprised of both flash memory and a flash memory controller, which simplifies the application interface design and frees the host processor from low-level flash memory management. This benefits product developers by simplifying the non-volatile memory interface design and qualification process – resulting in a reduction in time-to-market as well as facilitating support for future flash device offerings. Small BGA package sizes and low power consumption make e•MMC a viable, low-cost memory solution for mobile and other space-constrained products.
 
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