http://pc.watch.impress.co.jp/docs/2006/1227/kaigai328.htm
Goto Hiroshige has compiled another great article with lots of diagrams and info.
Goto Hiroshige has compiled another great article with lots of diagrams and info.
Wii, Xbox 360, PS3 and future revision + info!
- Thread starter StefanS
- Start date
crazygambit
Regular
Translation would be really nice for the rest of us.
Oh yes please. Is chocolate a good bribe?
4 Gigabits, not bytes. The diagram is showing the expected move in size and count of memory modules.
EDIT: Well, Skyring just sweeps on in and takes all the glory.
It's a prediction as to what form some silicon revisions down the line might take for the three consoles.
It looks like a very bare-bones prediction of the current hardware (on the left) and possible future streamlining (the right diagrams).
And the only changes appear to be, using larger, fewer RAM modules, and integrating some stuff together into a single die (EE+GS into PS3 south bridge, and EDRAM/Rops into Xenos).
BTW, their die areas appear interesting. I think Isuppli had listed both Xenos and XCpu as 180mm^2, and B3d had stated ~240mm^2 for RSX. The Pcwatch figures are 168/170 for XCPU/Xenos, and 260/228 for RSX/Cell. I dont know how accurate their figures are, but that's a lot more silicon on PS3. Then again, as usual they dont list a figure for the Xbox360 EDRAM (estimates are ~70mm^2, but nobody ever seems to measure).
If you assume EDRAM at 70MM^2, and use PCwatch's figure as opposed to some others, it works out to a total silicon of about 410 for 360, and 490 for PS3.
Why would you do that?
The diagrams show perfectly logical transistion that I would expect. The main focus here is to reduce cost and therefore cut loses on the hardware. Getting rid of the PS2 parts for example that are inside the PS3, that helps cut cost. Placing the EDRAM and ROP daughter die directly into Xenos, etc. Its all done to reduce cost and therefore start making money off of hardware. There's no reason at all to increase performance in a console that's already been released.
Okay, thanks for clarifying. I was confused in that I thought they were predicting what future consoles (after PS3, Wii, 360) would be. My bad.
It's integrated on the die already, no need to mention it in the context of future cost reduction.
Plus the size of the embedded memory is still not confirmed. Either he knows but can't say it, or he doesn't know and doesn't want to be caught speculating.
Q: Based on past discussions (foggy), are there possible issues with the consolidation of memory chips as shown in the Xbox 360 chart? I know there was some negative vibes about consolidating the 8 chips into 4 due to some technical issues (like addressing and effective bandwidth?)
Anything thoughts?
Anything thoughts?
