Also, all rumors I've seen so far point at three cores, a clock speed between 3.0 and 3.5GHz and a sizable L2 cache. I still think the 470S would have been a good foundation, but that chip simply doesn't fit in with any rumor.
The 470 cores fit well with requirements:
1.6GHz in slow/ low power process (ie faster in processes with more emphasis on speed).
2 W/core at 1.6GHz.
<4 mm² per core (excluding L2).
Possibility to add VMX unit to the core.
A 1.6-2GHz 4 core implementation, with each core having 256KB L2 cache, would be less than 35mm² and use less than 15W. Performance would be equal or above Xenon.
I would't put too much stock in the rumours of a high clocking, high power consumption CPU
Cheers
I would't put too much stock in the rumours of a high clocking, high power consumption CPU
I agree that the 45nm CPU from IBM that has more numbers to go inside the Wii U is the PowerPC 476FP and the reason is the size of the box and power consumption, the second possibility is a derivative of the one used in the Xbox 360.
This is an old pdf about the processor but something curious is that Nintendo puts a Wii in Page 4 as a possible application for this architecture:
https://www-01.ibm.com/chips/techlib/techlib.nsf/techdocs/D393643EC6B662E78525763200547AED/$file/476fp_wp_04_07_2011.pdf
The question is... how many cores?
Well, while it is difficult to separate the power consumption of the Xenon part of the 45nm chip in the latest XBOX360, I think a rough estimate might be 30W. An updated version targeted at 45nm SOI might well be below that while still containing various improvements. And a 20+W CPU is probably acceptable. IMHO it should be kept to the minimum power draw required to qualify as a Xenon+ though, allowing as much as possible of the power budget to go to the GPU.
The 750 line, according to IBM, is completely unsuited for SMP - highly inefficient even with massive modifications. So I'd say there's a 99.9% chance that won't happen.
Also, all rumors I've seen so far point at three cores, a clock speed between 3.0 and 3.5GHz and a sizable L2 cache. I still think the 470S would have been a good foundation, but that chip simply doesn't fit in with any rumor.
Leave the floating point number crunching to the GPU?Just to have a point of comparability, in gflops how much would it able to do?
Although lower latency memory, 5 instruction per cycle and OoOE may be a quite good, I guess it will still need to do a high number of gflps for physics/animations and the such heavy games?
Anyway it seems a fine choice.
According to a former AMD employee who worked on the project, Wii U uses an SoC - in which case the 470S seems a lot more plausible all of a sudden. Also, from what I can tell, a lot of the development work is done in India, and someone from the PPC4xx team at IBM India was working on a project together with US and Japanese teams...
According to a former AMD employee who worked on the project, Wii U uses an SoC - in which case the 470S seems a lot more plausible all of a sudden. Also, from what I can tell, a lot of the development work is done in India, and someone from the PPC4xx team at IBM India was working on a project together with US and Japanese teams...
Leave the floating point number crunching to the GPU?
A modified and speed-bumped version of the Wii core is the easiest path for the CPU side of the backwards compatibility.
If the CPU were really an overclocked Wii CPU then Wii U would also have 100% BC with the GAMECUBE.
Game over good Sir.
Speaking of the GPU, which, after all, is in the title of this thread, the article hypothesized that Nintendo might go for an EDRAM + GDDR3 combo for price reasons. According to my back of the envelope calculations the EDRAM amounts discussed would require some 30mm2 of die area on TSMC 40nm excepting any control cirquitry, and I'm just not sure that GDDR5 commands such a price premium that it constitutes a significant saving to avoid it. And since we can probably assume that the CPU will access the same pool of memory, a slower main memory solution impacts the whole of the system.
For those more graphically inclined, are there other benefits to EDRAM + GDDR3 over a straight GDDR5 interface?
It makes sense, given the above info/estimations you can get 4 cores and edram in about 60mm^ (assuming the PPC 476 core + L2 to be about 8mm^).
That leaves at the very least 140mm^ for a GPU (a 4750 40nm is 138mm^ and a 4870 55nm is 256mm^, with a lot of stuff not needed in a console).
To do a reference a Phenom X4 is 258mm^ it is cheap while running at 2x the speed.
They may just go for easier development and beef up the CPU?
According to a former AMD employee who worked on the project, Wii U uses an SoC - in which case the 470S seems a lot more plausible all of a sudden. Also, from what I can tell, a lot of the development work is done in India, and someone from the PPC4xx team at IBM India was working on a project together with US and Japanese teams...