Sounds good.
1,2v at 2,4 gbps and... „In addition, Samsung increased the number of thermal bumps between the HBM2 dies, which enables stronger thermal control in each package. Also, the new HBM2 includes an additional protective layer at the bottom, which increases the package's overall physical strength.“
It's not a good idea to talk about Hynix Databooks after the stuff, which happened with HBM2. Have you noticed that 2,0gbps HBM2 is also listed as Q1 for availability? This means that Hynix is writing since a year in their databook, that HBM2 will be available next quarter, but they still don't have a working mass production. They must have major problems with HBM2.