PSP to have 30M of RAM

I don't know exactly how well PSP's (graphics) feature set compares to Dreamcast. maybe Panajev or others can elaborate on this.

All I know is, PSP's feature set is said to be better than that of PS2.
 
Megadrive1988 said:
I don't know exactly how well PSP's (graphics) feature set compares to Dreamcast. maybe Panajev or others can elaborate on this.

All I know is, PSP's feature set is said to be better than that of PS2.

well thats not hard considering in many ways the vodoo was on par with the ps2 feature set. The rest had to be done in software .
 
PC-Engine said:
Typical polygon numbers for PSP will probably be bound by storage if it ends up with only 12 MB total.

And crazy me thought it supported HOS for a reason.
 
Vince said:
PC-Engine said:
Typical polygon numbers for PSP will probably be bound by storage if it ends up with only 12 MB total.

And crazy me thought it supported HOS for a reason.

True, but PS2 also supports HOS, but you don't see it being used in games much if at all...
 
akira888 said:
0.331 (square microns)/bit @ 90nm according to NEC.


At 0.331 micron2, the 0.13-micron DRAM cell is smaller than the 0.422 micron2 cell of NEC's prior-generation process, and contributes to a 10 percent reduction in block size that reduces resistance in the circuit's bit lines.

Also,

"The cells are actually not all that small," he said. In fact, Toshiba Corp. has built a 0.19 micron2 cell that it plans to use on its 100-nm eDRAM technology. "But we are concentrating on speed," Kishi said, "so we have to think of the right tradeoffs in other areas."

NEC and Atmos Corp. will jointly develop merged-logic embedded DRAM chips running between 400 MHz and 1 GHz. The companies hope the technology will replace SRAM in network processors, DSPs, ATM switches and routers.

The partners expect to start shipping volume quantities of their superfast logic-memory chips on the 130-nanometer process node by summer of 2002, said Hideya Horikawa, design-engineering manager of NEC Electronics Inc. They will prototype parts on the 0.13-micron process in the second half of next year and launch full production beginning in 2003, he said.
 
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