We know price reduction flexibility is much reduced. These are the die shrinks that happened for PS2...
PS4 has only had one, from 28nm to 16nm. Until there's a better node available in terms of cost savings of tech plus price due to demand for better nodes for other sectors like mobile that PS2 didn't have to contend with, PS4 can't price reduce the core silicon. HDD prices can't get cheaper than the cheapest already in use. ODD won't get cheaper than the cheapest already in use. RAM prices may drop a bit. Other components cost the same unless the board overall can be shrunk through lower power.
The only real option probably is the rumoured XB1 diskless SKU. A die shrink coupled with ODD removal, box shrink, flash instead of HDD, would allow a notably cheaper base price. That's not really on the cards until there's a node suitable. Can anyone suggest when that'd be?
PS4 has only had one, from 28nm to 16nm. Until there's a better node available in terms of cost savings of tech plus price due to demand for better nodes for other sectors like mobile that PS2 didn't have to contend with, PS4 can't price reduce the core silicon. HDD prices can't get cheaper than the cheapest already in use. ODD won't get cheaper than the cheapest already in use. RAM prices may drop a bit. Other components cost the same unless the board overall can be shrunk through lower power.
The only real option probably is the rumoured XB1 diskless SKU. A die shrink coupled with ODD removal, box shrink, flash instead of HDD, would allow a notably cheaper base price. That's not really on the cards until there's a node suitable. Can anyone suggest when that'd be?