TSMC is in volume production of 7-nm chips today with more than 50 tapeouts expected this year. It’s making CPUs, GPUs, AI accelerators, cryptocurrency mining ASICs, networking, gaming, 5G, and automotive chips.
The node delivers 35% more speed or uses 65% less power and sports a 3x gain in routed gate density compared to the 16FF+ generation two steps before it. By contrast, the N7+ node with EUV will only deliver 20% more density, 10% less power, and apparently no speed gains — and those advances require use of new standard cells.
TSMC has validated in silicon what it calls foundation IP for N7+. However, several key blocks will not be ready until late this year or early next year, including 28–112G serdes, embedded FPGAs, HBM2, and DDR5 interfaces