Santa Clara, CA and Hsin-Chu, Taiwan – Feburary 24, 2004 – NVIDIA Corporation (Nasdaq: NVDA) today confirmed that it will be one of the first semiconductor companies to manufacture select up-coming graphics processing units (GPUs) at Taiwan Semiconductor Manufacturing Company’s (TSMC’s) (TAIEX: 2330, NYSE: TSMC) 0.11 ìm (micron) process technology. NVIDIA will combine TSMC’s 0.11 micron process with its own innovative engineering designs, to deliver high-performance and low-power consumption in a graphics processor.
TSMC’s 0.11 micron process technology is fundamentally a photolithographic shrink of its industry-leading 0.13 micron process. The process will be available in both high-performance and general-purpose versions using FSG-based dielectrics. Though actual results are design-dependent, TSMC’s 0.11 micron high-performance process also includes transistor enhancements that improve speed and reduce power consumption relative to its 0.13 micron FSG-based technology.
TSMC began 0.11 micron high-performance technology development in 2002 and product qualified the process in December of 2003. Design rules, design guidelines, SPICE and SRAM models have been developed, and third-party compilers are expected to be available in March. Yields have already reached production-worthy levels and the low-voltage version has already ramped into volume production. The 0.11 micron general-purpose technology is expected to enter risk production in the first quarter of next year.
Source: nvidia
( From Guru3D )
RainZ
TSMC’s 0.11 micron process technology is fundamentally a photolithographic shrink of its industry-leading 0.13 micron process. The process will be available in both high-performance and general-purpose versions using FSG-based dielectrics. Though actual results are design-dependent, TSMC’s 0.11 micron high-performance process also includes transistor enhancements that improve speed and reduce power consumption relative to its 0.13 micron FSG-based technology.
TSMC began 0.11 micron high-performance technology development in 2002 and product qualified the process in December of 2003. Design rules, design guidelines, SPICE and SRAM models have been developed, and third-party compilers are expected to be available in March. Yields have already reached production-worthy levels and the low-voltage version has already ramped into volume production. The 0.11 micron general-purpose technology is expected to enter risk production in the first quarter of next year.
Source: nvidia
( From Guru3D )
RainZ