No, of course not. Did I say so? If yes, that wasn't my intention.There is no variant of HBM1 with 9 dies.
No, of course not. Did I say so? If yes, that wasn't my intention.There is no variant of HBM1 with 9 dies.
"HBM gen2 will physically be larger than HBM gen1". What is this "gen" thing you refer to?No, of course not. Did I say so? If yes, that wasn't my intention.
It's done routinely. Often extra unconnected metal wire called "fill" is added to free space in interconnect layers mostly to keep polishing thickness consistent over the area of the circuit, but it's also useful for its thermal conductivity to keep one region from accumulating too much heat. This is mostly to reduce very local temperatures (both absolute and differential) which causes physical stress as different materials expand differently with temperature, leading to failure."dark silicon" as part of cooling solution? Cool idea!
No thats actually the reason, I've been planning for over half a year actually make a jump to Pascal.Why not wait a bit for actual prices before starting the round of complaints (about a product that you probably aren't going to buy anyway?)
"HBM gen2 will physically be larger than HBM gen1". What is this "gen" thing you refer to?
Short form of "generation"?What is this "gen" thing you refer to?
Is it ecc memory, or did you use parity bits?I think he was talking about die size in regard to total package size of HBM2 vs HBM1.
HBM1 was what? ~40mm2.
HBM2 is supposedly more than twice the size of HBM1, ~90mm, if my memory is correct.
Correct, it 40mm2 for HBM1 and 92mm2 for HBM2.I think he was talking about die size in regard to total package size of HBM2 vs HBM1.
HBM1 was what? ~40mm2.
HBM2 is supposedly more than twice the size of HBM1, ~90mm, if my memory is correct.
That's the JEDEC spec, though some people have chosen to use the moniker HBM2."HBM gen2 will physically be larger than HBM gen1". What is this "gen" thing you refer to?
Maybe I misunderstood but preemption is at the instruction boundaries means it is before the end of a draw call?"Compute Preemption" on Pascal. Where are the limits to that, respectively what can be preempted?
Nvidia claims compute tasks can be preempted at an instruction level granularity. But NV also differentiates between compute and display tasks, and claims the preemption related benefits, including proper debugging using HW breakpoints, only for compute tasks/kernels.
Just an oversight, or does this mean that kernels dispatched from a draw call can not be subject to preemption and debugging for these is therefor limited as well?
Also: The "GigaThread Engine" is a complete black box once again.
NVIDIA has stated already that it's still based on preemption, so I doubt itPreemption is great but the ability to prioritize and run graphics and compute kernels concurrently is a more elegant solution to the problem. Wouldn't be surprised at all if they announce that capability at the GeForce launch.
NVIDIA has stated already that it's still based on preemption, so I doubt it
http://www.theregister.co.uk/2016/04/06/nvidia_gtc_2016/The Register said:Software running on the P100 can be preempted on instruction boundaries, rather than at the end of a draw call. This means a thread can immediately give way to a higher priority thread, rather than waiting to the end of a potentially lengthy draw operation. This extra latency – the waiting for a call to end – can really mess up very time-sensitive applications, such as virtual reality headsets. A 5ms delay could lead to a missed Vsync and a visible glitch in the real-time rendering, which drives some people nuts.
NVIDIA has stated already that it's still based on preemption, so I doubt it
No they haven't, and we have seen that it doesn't need preemption to do these operations, only in DX has this be an issue and only after certain amount of time.
And the only people that have stated its based on preemption, has been AMD, I think that was Hallock. Which doesn't seem to add up to the tests we have done here and when profiling different games with different API's.