Quite a few (full) nodes have been exploited to actually raise power over the previous generation in the past, tbh. Of course, this had more than anything to do with ever more complex chip layouts and thermal/power headroom untapped by the previous generation. With R600/GT200, this option became quite exhausted - and that's also the reason why we are not seeing any +100 perf. improvements over the immediate predecessor any more: You simply cannot add manufacturing improvements up with a higher power budget, but have to work extra hard to keep power in check, possibly leaving some performance on the table.
150 -> 130nm: NV20 to NV30, requiring a power connector
130 -> 90nm: NV40 to G80 - breaking the 100 watt barrier, same is true for R48x -> R520/580
90 -> 65nm: G80 to GT200, breaking the 200 watt barrier, same is true for R600 (80nm) coming from
R5xx.
65 -> 40nm: Approaching 300 watts in case of fermi, AMD starting to employ more conservative steps at to perf and power
40 -> 28nm: AMD has improved performance AND lowered power compared to Cayman, Kepler yet to be determined.
150 -> 130nm: NV20 to NV30, requiring a power connector
130 -> 90nm: NV40 to G80 - breaking the 100 watt barrier, same is true for R48x -> R520/580
90 -> 65nm: G80 to GT200, breaking the 200 watt barrier, same is true for R600 (80nm) coming from
R5xx.
65 -> 40nm: Approaching 300 watts in case of fermi, AMD starting to employ more conservative steps at to perf and power
40 -> 28nm: AMD has improved performance AND lowered power compared to Cayman, Kepler yet to be determined.