28nm On Track with the Roadmap
Instead of 32nm fabrication process, TSMC concentrates on 28nm technologies. Initially the company plans to launch 28nm SiON/Poly process for low-power devices and later on it will roll-out high-k metal gate (HKMG) based technologies for more advanced products.
“The first node we are going to release for the 28nm will be called the 28LP. This is our poly gate and silicon oxide nitrate version. We will establish production at the end of June this year, about four months from now, and this is for the low power application. […] The first HKMG process we call 28HP for the high performance application will be introduced by the end of September this year, and followed by three months later December will be the 28HPL, which is [our] first high-k metal gate introduction for the low power application,” said Mr. Chiang.