CMKRNL said:It appears that TSMC has run into manufacturing issues with NV30. Possible respin required to work around them -- which may jeopardize working silicon at Comdex.
CMKRNL said:It appears that TSMC has run into manufacturing issues with NV30. Possible respin required to work around them -- which may jeopardize working silicon at Comdex.
Sabastian said:Oh I will say it ...... Link please.
CMKRNL said:It appears that TSMC has run into manufacturing issues with NV30. Possible respin required to work around them -- which may jeopardize working silicon at Comdex.
sancheuz said:I see no source, i dont believe a word. Show me reliable sources.
RussSchultz said:It might result in a full layer change. But its all complete speculation.
Sabastian said:RussSchultz said:It might result in a full layer change. But its all complete speculation.
that is not good news for nvidia .... of course it is pure speculation. I guess in reality it is all speculation untill officially announced though.
The NV30 graphics chip was planned to be launched using TSMC’s 130nm copper and CVD based low k dielectric process. This would have been the first chip tape out for volume production using the most advanced foundry process currently available.
“At 0.13microns most companies will be using copper and low k,†Mosesmann told Semiconductor Fabtech. “With these new materials introduced, it has simply been a nightmare.â€
During Semicon West, held in mid-July in San Francisco, equipment suppliers and materials providers continued to produce a wave of technical paper presentations, detailing a growing list of process integration challenges still being tackled both in R&D and production fabs. Low k CMP issues were being viewed as particularly challenging.