Depends on where lithography goes. Sony may be looking at a very limited set of cost-saving die-shrink options (same as everyone else) and to ensure decent yields of large parts, is deciding to keep the dies split. If combining them down the line becomes a sensible option, they'll do so. Otherwise, they won't.
And the persistently high price of PS3 and PS4 suggests they are happy to keep the entry level price higher over the full life of the platform.
Edit: Actually, that's not really what you were asking.
Are they going to gamble on interposer with a view towards APU, or do two dies forever (MCM long term option). I'd think the second. Given how cost scaling isn't happening these days, with the latest nodes costing as much or more as the larger nodes, the expectation would be that an economical single-chip solution won't be realistic within 5 years of launch. If you're going to go max performance, and so need two larger dies, find the cheapest way to do that. More silicon up front would be with a view to a more powerful launch unit and a longer life, IMHO.