New AMD low power X86 core, enter the Jaguar

Discussion in 'PC Industry' started by liolio, Aug 28, 2012.

Tags:
  1. Sxotty

    Legend Veteran

    Joined:
    Dec 11, 2002
    Messages:
    5,256
    Likes Received:
    598
    Location:
    PA USA
    Yeah :) I was hoping for a lot more choices, but this is ok at least. I had wanted the 5000 not the 5200 so I could save 10watts.
     
  2. Alexko

    Veteran Subscriber

    Joined:
    Aug 31, 2009
    Messages:
    4,532
    Likes Received:
    957
  3. Sxotty

    Legend Veteran

    Joined:
    Dec 11, 2002
    Messages:
    5,256
    Likes Received:
    598
    Location:
    PA USA
    How you use it is limited by your imagination and time you have on your hands I guess. Anyway that is not a bad idea. If it is a standard motherboard in the zotac I might be very tempted to get one as it would probably be the cheapest. I would have to either be able to attach a normal power supply to use the automotive supply I have, or make a new circuit that turns the computer on and off with the car (by temporarily connecting the circuit to the power button when the car is turned on or off).
     
  4. AnarchX

    Veteran

    Joined:
    Apr 19, 2007
    Messages:
    1,559
    Likes Received:
    34
  5. Thorburn

    Regular

    Joined:
    Oct 8, 2006
    Messages:
    323
    Likes Received:
    19
    Location:
    UK
  6. AnarchX

    Veteran

    Joined:
    Apr 19, 2007
    Messages:
    1,559
    Likes Received:
    34
    Diffused = fabbed.

    The big AMD APUs have also this printing.
    A bit strange is also that this Kabini chip is packaged/made in Taiwan (= TSMC!?), while the big APUs and other CPUs at AMD are packaged in Malaysia.
     
  7. 3dilettante

    Legend Alpha

    Joined:
    Sep 15, 2003
    Messages:
    8,555
    Likes Received:
    4,725
    Location:
    Well within 3d
    There could be a different entity responsible for this product's package assembly besides TSMC in Taiwan. Since other Jaguar chips say they are diffused and made in Taiwan, it might make sense to use existing package assembly right now.
     
  8. Exophase

    Veteran

    Joined:
    Mar 25, 2010
    Messages:
    2,406
    Likes Received:
    430
    Location:
    Cleveland, OH
  9. 3dilettante

    Legend Alpha

    Joined:
    Sep 15, 2003
    Messages:
    8,555
    Likes Received:
    4,725
    Location:
    Well within 3d
    Diffusion in this case is a phase of the lithography process that is also being used as a general label for the fab's part of the process of creating a wholly functional product.
     
  10. Exophase

    Veteran

    Joined:
    Mar 25, 2010
    Messages:
    2,406
    Likes Received:
    430
    Location:
    Cleveland, OH
    That's pretty confusing - do you have a reference on this?
     
  11. 3dilettante

    Legend Alpha

    Joined:
    Sep 15, 2003
    Messages:
    8,555
    Likes Received:
    4,725
    Location:
    Well within 3d
    Referencing a discussion in this forum on the same topic would include posts by me.

    Diffused in this case is shorthand for the fabbing of the wafer.

    IBM discusses some of the requirements for the diffused and made in labels, and it distinguishes between diffusion and the bonding and packaging steps that involve taking a die and affixing it to something that makes it usable.

    http://www-03.ibm.com/procurement/proweb.nsf/contentdocsbytitle/United+States~Country+of+origin+marking+instructions?OpenDocument&Parent=Global+Procurement

    A Google search brought up this (odd thing about this link, it might try to print something):
    http://rulings.cbp.gov/detail.asp?ru=w968421&ac=pr

    This clearly differentiates between the diffusion step and cutting things into separate die and testing/mounting them.

    There may be subtleties to customs enforcement or taxation reasons for doing this. Until the chip is fully packaged, it's not really a functional product.
     
  12. liolio

    liolio Aquoiboniste
    Legend

    Joined:
    Jun 28, 2005
    Messages:
    5,724
    Likes Received:
    194
    Location:
    Stateless
  13. ToTTenTranz

    Legend Veteran

    Joined:
    Jul 7, 2008
    Messages:
    12,144
    Likes Received:
    7,106
  14. kalelovil

    Regular

    Joined:
    Sep 8, 2011
    Messages:
    567
    Likes Received:
    102
    http://techreport.com/review/26377/a-first-look-at-amd-mullins-mobile-apu

     
  15. Wynix

    Veteran Regular

    Joined:
    Feb 23, 2013
    Messages:
    1,052
    Likes Received:
    57
    I think this is worth quoting:
    That is impressive.

    There's a lot of useful info in that article.
     
  16. kalelovil

    Regular

    Joined:
    Sep 8, 2011
    Messages:
    567
    Likes Received:
    102
    It probably is impressive, but I'd wait until AMD allow real-world power consumption figures to be produced before coming to any firm conclusions.

    Remember that the Kaveri 7600T in 45W mode looked incredibly impressive next to its 45W Richland predecessor, but this was diminished somewhat by the 45W Kaveri consuming a significant amount more power than the 45W Richland.
     
  17. lanek

    Veteran

    Joined:
    Mar 7, 2012
    Messages:
    2,469
    Likes Received:
    315
    Location:
    Switzerland
    Thanks for the link... The results shown on the Mullin seems good..
     
  18. Alexko

    Veteran Subscriber

    Joined:
    Aug 31, 2009
    Messages:
    4,532
    Likes Received:
    957
    True, but so long as the TDP is respected, that's OK. Chances are that Temash/Kabini SKUs were often operating well below their TDPs, leaving performance on the table. Now Beema/Mullins should be able to operate very close (or temporarily above) their TDPs. To be sure, effective performance/W is unlikely to have increased as much as AMD claims, but so long as the performance is there and the TDP is respected, it's not an issue. AMD also claims that getting things done quicker and going to sleep/idle saves energy (and therefore battery life).

    That said, it doesn't change the fact that there does not seem to be a whole lot of interest in x86 tablets. I also wonder why AMD hasn't released a 25W variant of Beema. Perhaps they believe this segment would be better served by the mobile Kaveri, but since the latter has yet to show up…

    It's also worth noting that this new SoC is made by GloFo, which means their process must be quite good.

    Edit, after reading The Tech Report's article (http://techreport.com/review/26377/a-first-look-at-amd-mullins-mobile-apu/ [benchmarks on pages 3 and 4]): looks pretty good.

     
    #278 Alexko, Apr 29, 2014
    Last edited by a moderator: Apr 29, 2014
  19. sebbbi

    Veteran

    Joined:
    Nov 14, 2007
    Messages:
    2,924
    Likes Received:
    5,296
    Location:
    Helsinki, Finland
    Intel has reduced their TDP impressively by improving the clock management and monitoring (huge improvements from Nehalem->Sandy->Ivy->Haswell). They can shut down / restore the chip parts in a very fine grained manner (and very quickly). AMD did something similar for R9 290X, and it seems that they now are integrating similar systems to their new APUs. Excellent news indeed.
     
  20. Lightman

    Veteran Subscriber

    Joined:
    Jun 9, 2008
    Messages:
    1,935
    Likes Received:
    914
    Location:
    Torquay, UK
    @Alexko

    AMD will be releasing 25W Beema, but it will be only to select OEM who requested it.
    It makes sense to reuse already developed 25W laptop platform and ask AMD to deliver better performance at the same time.

    These special 25W(?) chips will be called A8-xxxx :)
    From TechReport
    There is also that possibility that I'm reading too much into this sentence :p
     
Loading...

Share This Page

  • About Us

    Beyond3D has been around for over a decade and prides itself on being the best place on the web for in-depth, technically-driven discussion and analysis of 3D graphics hardware. If you love pixels and transistors, you've come to the right place!

    Beyond3D is proudly published by GPU Tools Ltd.
Loading...