Exactly. And since the 5700 runs pretty cool too, i think the 210 million part should be the one we all saw the pretty pictures of and they are without any doubt IBM samples (core PCB, ASIC).JoshMST said:It could very well be, or it could also be that the 175 million tran part was supposed to be introduced this April, while the 210 million tran part was going to be a fall "refresh" product. This could still be the case, but perhaps that 210 mil part was ready well before they were expecting and decided to release that also.
From my limited knowledge of fabrication and chip design, each particular design for a fab uses a "standard cell", that cell is either provided by a 3rd party or the fab partner. In this case, the IBM standard cell is quite different from the TSMC standard cell. So, would it really be in NVIDIA's best interest to port the same chip to each major fab? That would involve thousands upon thousands of man hours and computing years to make sure that the design would work with two different standard cell designs. So basically, what I think NV would do is choose which design will be manufactured where (eg. the FX 5700 is only manufactured by IBM, while the FX 5900/5950 is only manufactured by TSMC).
So, if this is truly the case, then there may be two high end NVIDIA chips in the wild here shortly. How they measure up? I have no clue.
EDIT: some poor spelling and editing on my part.
If those rumours are correct, TSMC may be the one that manufactered the 175 million part, and this info leaked pretty early, but they both seem to have been taped-out at almost the same time.