The FlexIO technology will be used to connect the various chips on a Cell-based motherboard, according to Rich Warmke, marketing director of the memory interface division at Rambus. A multicore Cell processor, by contrast, will use its own internal bus to connect multiple cores. However, 90 percent of the Cell's external pins are connected to either the FlexIO or XDR interfaces, evidence that the Cell's design emphasizes moving application and or 3D scene data around within main memory, Warmke said.
http://www.extremetech.com/article2/0,1558,1761407,00.asp
So a multi PE chip is planned at least.
Fredi