Taipei, Dec. 3, 2012 (CENS)--Taiwan Semiconductor Manufacturing Co. (TSMC) cranked out 52,000 300mm wafers processed using 28nm process technology at its Fab 15 factory in central Taiwan in November 2012, surpassing planned 50,000 wafers, and the output is likely to reach 75,000-80,000 wafers in December, more than planned 68,000 wafers.
TSMC began volume production of 28nm chips in October, 2010, with initial output of around 1,000 wafers a month. Fab 15 is the foundry giant’s pivotal production site for 28nm chips, turning out over 10,000 wafers using the process in the second quarter this year. The monthly output of 52,000 wafers marked the unprecedented volume production speed at the company’s giga-size foundry factories.
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TSMC will begin tooling the phase 4 and phase 5 production modules of Fab 15 sometime in December and put the two modules into volume production in the second quarter of 2013. Employees at the factory will increase to 2,400 in 2013 from current 1,800. This fab will take TSMC a total of NT$300 billion (US$10.3 billion) to complete in 2015.
TSMC is estimated to begin pilot production of chips at 20nm nodes in the second half of 2013 and volume production of the chips in 2014.