So you suspect DP was removed from wuugpu? If that is so, that would harm the GPGPU capabilities of the chip - which is a flag I'm not sure Nintendo ever really carried in public at least, but many fans certainly did.
Of course, AMD's VLIW architecture wasn't ever any damn good really for GPGPU apps, but no DP would just be another aspect where wuu continues to underwhelm.
So you suspect DP was removed from wuugpu? If that is so, that would harm the GPGPU capabilities of the chip - which is a flag I'm not sure Nintendo ever really carried in public at least, but many fans certainly did.
Of course, AMD's VLIW architecture wasn't ever any damn good really for GPGPU apps, but no DP would just be another aspect where wuu continues to underwhelm.
http://i.imgur.com/mrWZj77.jpg
Maybe they added DP to Wii U. And that is why its larger than Brazos.So you suspect DP was removed from wuugpu? If that is so, that would harm the GPGPU capabilities of the chip - which is a flag I'm not sure Nintendo ever really carried in public at least, but many fans certainly did.
Of course, AMD's VLIW architecture wasn't ever any damn good really for GPGPU apps, but no DP would just be another aspect where wuu continues to underwhelm.
Hmmmm I thought chipworks said it was TSMC which is what the thread at Neogaf says in the first page.If it's Renesas's 40nm and not TSMC's it may just not be as dense.. TSMC's 40nm is very dense. Renesas offers a lot of the IP for modules this GPU would have (but TSMC probably does as well). Chipworks has looked at plenty of Renesas chips so they'd probably have recognized it, but they didn't give insights in any official capacity so the commentators aren't necessarily their best representatives.
The die is exactly 11.88 x 12.33mm (146.48mm²). It's manufactured at 40nm, apparently on an "advanced CMOS process at TSMC".
How large is the large eDRAM pool in mm^2?Hey folks.
Just a correction: It is not confirmed 40nm TSMC. Jim from Chipworks contacted me after and said that it was just his guys' assessment. It could very well be Renesas in house fab. Of course, that means it could also be 55nm, but I still think the eDRAM density makes a good case against that.
Cheers!
You need a minimum time here/number of posts.How do I edit/delete my post? That last post was pointless.
The whole EDRAM block takes 38.68mm².How large is the large eDRAM pool in mm^2?
IBM's eDRAM at 45nm is 11Mb/mm^2.
Well if it is not made by TSMC like suggested, 55nm does solve all the questions regarding the areas of the blocks. Sorry for the misquote of 45nm, I just skimmed the article. I know the density could be different between foundries but I am unaware of how much the difference is.A) The 11Mb/mm^2 figure is for 32nm.
B) eDRAM density can be different between foundries.
C) TSMC's 40nm eDRAM 1Mbit array figure seems to fit rather well (0.145mm^2/Mbit)
I still think the eDRAM density makes a good case against that.
How do I edit/delete my post? That last post was pointless.
Anyways I got my answer for the eDRAM die area. ~40mm^2 for 32MB of eDRAM, which means 6.4Mb per mm^2. Pretty much on point with 55nm density and not 40nm if that is the case. IBM's eDRAM at 45nm is 11Mb/mm^2.
At least if we just look at the array blocks (none of the overhead circuitry or massive spacing between the arrays, just one group of yellow rectangles), the 32MB partition is composed of 16*8*256kB arrays, and 1Mbit is about 0.102mm^2 (pixel area/image area * 146.48mm^2). The smaller partition above is 2MB, yes? So, 16*128kB arrays, about 0.126mm^2 per Mbit.
Anyways, the density is in that sort of ballpark, of course lower if you just take the whole partition area including the I/O & misc circuitry.
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Haven't checked Renesas eDRAM densities lately. Someone?
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Still bizarre with the Brazos shader block being ~0.90mm^2 and the one on WiiU is ~1.46mm^2. :s The latter is closer to the 1.62mm^2 blocks in rv770.
My measurements tell me it's more like 1.89mm².
Cell size is apparently .12um^2 (40nm is .06um^2).