That is:
CPU - 2 MB eDRAM L2 cache shared between three cores
GPU - 32 MBs eDRAM workspace
I mean large eDRAM quantities, the typical use for eDRAM which some are believing in here. eDRAM can be replaced with SRAM as cache, although it obviously brings something to the mix regards hitting Nintendo's targets.
Ok, how are you (guys) coming up with the 2MB figure? And has 32 MB for the GPU been confirmed outside of Digital Foundry?
Another question, regarding the MCM.
I had asked in an earlier post if Nintendo would split their 2GB memory into two pools.
Based on what we can see, would Nintendo put 1GB of that memory directly on the
the MCM, maybe as a "chip-stack" package? According to ArsT, they state:
combining components from chip-makers Renesas (RAM), IBM (CPU), and AMD (GPU) on a single component was a challenge
In 2011 AMD came out with: AMD Radeon E6460
an entry-level GPU with more than 2x the performance of the previous-generation Radeon E2400 GPU. To get the desired performance from this GPU—it’s capable of driving four displays simultaneously—AMD elected to use a BGA with the flip-chip GPU die bonded to the BGA package and there are two soldered GDDR5 high-performance graphics SDRAMs on the BGA as well. Thus we have a 3D multichip module (MCM) with the three semiconductor devices bonded to a BGA package that serves as an electrical interposer between the three chips.
Or because of the on chip eDRAM is this unnecessary?