Sony PSP from a 3D Technology perspective...

In reference to that link about the possibility of a GCP

Shrinking all the cips in the gamecube from .18 to .09 micron and adding in various other power saving technologies and clock throttling, makes it seem possible that they could get it into a handheld format... I wouldn't have thought that before seeing PSP, but after seeing it, it seems plausible. That said, can you shrink circuit boards in the same manner? Do they shrink traces on board periodically, like they do in chip production? It seems like that might be the hardest bit of the gamecube to shrink down to make into a portable form factor (by size, if not by energy consumption). Can anyone shed light on the subject?

Thanks!
 
Yes, and no.

There is a lower limit on easily manufacturable PCBs, however, if you take several chips and integrate them into one chip, you solve the PCB problem by doing away with the PCB that would sit between the two chips.

Or, assuming it is too difficult to integrate them on one die (for example, mixing high speed logic and DRAM or flash) , you can put several die in one package (which sits on a miniaturized "PCB"). You then embed these die in one package. It costs more than a normal package, but not enormously more.
 
What does everyone think of the curved surfaces section? Is it going to be actually useful or is it going to end up like the GF3 'HOS' engine?
 
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