cheapchips
Veteran
Don't pick on them. They're trying their best.lol
When TSMC says "1H 2018", translated back into regular English that means "99% coming out before 2020".
Their timetables are always laughably inaccurate.
Don't pick on them. They're trying their best.lol
When TSMC says "1H 2018", translated back into regular English that means "99% coming out before 2020".
Their timetables are always laughably inaccurate.
It is also limited to just 4GB with bigass 4096bit wide memory controller. MS would need to use HBM2 to reach 8GB.My understanding is AMD's first implementation of HBM is 512 GB/s.
from a bandwidth perspective this isn't a big deal. But the esram has really low latencies, which could get a problem. Also the bandwidth of esram is well... was it ~208 GB/s (peak) but only for 32MB memory. to emulate that just try to calculate how fast the HBM memory needs to be to reach that massive bandwidth for that little memory. Well the esram is devided into 512KB chunks, each chunk can reach a bandwidth of 3.25 GB/s (when we calculate with this 208GB/s). Question is, can HBM reach this bandwidth for a 512KB or for 64 512KB memory blocks? at least for a 1:1 emulation.If Microsoft ditched ESRAM for the Xbox One.5 or Xbox Two, could they use HBM to simulate ESRAM for backwards compatibility? My understanding is AMD's first implementation of HBM is 512 GB/s. Because they have some API abstraction, could they not fake ESRAM by directing those api calls to a portion of HBM? Just wondering what issues I might be missing. Really, I guess what I'm asking is how Microsoft can ditch ESRAM and maintain backwards compatibility.
Also, as a hypothetical, could Microsoft release an Xbox One.5 with 8GB of HBM, but with lower bandwidth than the Fiji cards? Say, half 256 GB/s, or is the bandwidth a function of the number of stacked chips? I suppose in that case they could go with GDDR5 or GDDR5x. DDR4 speed doesn't seem to compare to ESRAM.
The ESRAM is not that special honestly; MS probably has a compile option in newer SDKs to bypass it.
They learned after Xbox 360.
So forgoing the 150-200 GB/s BW it offers and limiting themselves to the ~60 GB/s of DDR3 only?The ESRAM is not that special honestly; MS probably has a compile option in newer SDKs to bypass it.
A "compile option" to bypass it, seriously?The ESRAM is not that special honestly; MS probably has a compile option in newer SDKs to bypass it.
They learned after Xbox 360.
But that does only work, because the Power architecture was so "slow" (most times) comparing to x86. The 10mb embedded DRAM was quite easy to emulate on the sram. but to emulate sram on dram is really hard.MS could ditch both the Jaguars and esram hinderings and could do a software approximate emulation like they did with X360 on XB1.
Even HBM2 has DRAM, so bandwidth, yes, but not latencies, and read & write at the same time.Just how much die space would it take up on a die shrink anyway? I think esram would shrink well in comparison to the rest of the die, so why not just leave it on there?
Next generation once you have HBM2 etc then can get rid of it via emulation.
From the recent conference call.Remember that they're also talking about their customers, who are not consumers, but fabless semiconductor companies. From chip tapeout to an actual consumer product can be a window of 12-18 months.
So forgoing the 150-200 GB/s BW it offers and limiting themselves to the ~60 GB/s of DDR3 only?