Yay for FUD! What a lame and utterly predictable response.
The Exact same statement as with the FX5800. ... ... and HD2900XT
Yay for FUD! What a lame and utterly predictable response.
LOL, That's so old! And they even got their Italian translation wrongWell, I surely am ready for what's next. Are you ready too? Gotta love those typical marketingmachine responses, but who knows... maybe they'll suprise everyone...
Yay for FUD! What a lame and utterly predictable response.
Yay for FUD! What a lame and utterly predictable response.
Damn, can't score lower than -300, I think the mouse lag's killing me.
Jawed
This is their official response, hardly breathtaking either.
Proprietary standards punish gamers, not industry standards like DirectX11. Why is NVIDIA punishing gamers by putting in proprietary and closed standards like PhysX in games?
he main reason for this is that NVIDIA normally send over an email asking if we've got samples and when we respond with a yes, we get some questions that they think we should be asking ourselves.
Because of the exponential relationship they can't give a flat percentage for that either Ailuros, still depends on design.
Does anyone know the average percentage of non redundant circuitry on a modern GPU so I can get some idea what 0.2 defect density will mean in October?
PS. that's per mm2 I assume? That seems awfully fucking high.
Just saying, anti-FUD FUD still is....
Nice comeback
See, it's just Nvidia being Nvidia....wouldn't matter if they were late to the party or not.
Sorry don't know the average percents of redundant/non redundant circuitry on GPU. Saw some figures for 55nm on chiphell might be able to use them to take some guesses.
Looking at Digitimes article not sure they quite got it right(The week before they were talking of TSMC 40nm capacity increasing form 30k wafers per month to 40k wafers per month when that is actually the total 40nm volume expected for the quarter). They talked of 28nm trial runs in first half of 2010, but i think that is more the later half of 2010(at least for HK), maybe they meant 32nm?
I think that the defect density the 0.2 is per cm2, ie D0 = 0.2/cm^2
Substituting into:
Yield = (1 + A * D0/alpha) ^(-alpha)
Assuming alpha = 4 implies:
GT218 56mm2 => 89.5%
GT216 100mm2 => 82.2%
GT215 140mm2 => 76.6%
GT300 530mm2 => 39.9%
For the competition:
RV740 137mm2 => 76.7%
Juniper 180mm2 => 70.8%
Cypress 330mm2 => 54.3%
Above i guess gives you a rough starting point, obviously real life is much more complicated and need to take account of the relative redundancy levels in each design, should be fairly simliar for say GT218->GT215 and some sort of sliding scale across Evergreen series...need some real life figures to make further estimates.
Using those approximations, how many of each chip would you get on average per wafer? Can't remember how many of each fit per wafer though I'm sure it has been mentioned in this or R8xx-speculation thread.
when was the last the last time any saw sampsa stick out his neck with presumable info, didn't he say something about the g80?
hmm when was the last time he didn't cards earlier then reviewer's