arjan de lumens
Veteran
Mmmm - watercooling. According to this watercooling FAQ, a good watercooling setup can reach a thermal resistance of 0.05K/W. This comes in addition to the 0.15K/W reistance of flip-chip packages the size of P3/athlon chips for a total of 0.20K/W (for chips around 1cm2; I expect this figure to be roughly inversely proportional to chip area). If we assume an ambient temperature of 20 degrees C and a maximum operating temperature of 85 degrees C, we get that a good watercooling setup can handle a heat output of (85-20)K/ 0.20K/W cm2 = 325 watts per square centimeter. For cooling beyond this point, one might use isotopically pure silicon, which should reduce the thermal resistance of the flip-chip die by ~35-40%, increasing maximum heat output to ~65/0.145 = 450 watts per square centimeter.
As for 0.13 micron, yes, it will generally reduce the power draw per time each transistor switches, but it allows transistors to both be packed into a smaller area per transistor and switch more frequently (higher clock speed), increasing the wattage per area unit for any given design. In addition, the power losses in interconnect is unchanged on a per-wire basis, and the per-transistor leakage power increases sharply with shrinking transistor dimensions.
As for 0.13 micron, yes, it will generally reduce the power draw per time each transistor switches, but it allows transistors to both be packed into a smaller area per transistor and switch more frequently (higher clock speed), increasing the wattage per area unit for any given design. In addition, the power losses in interconnect is unchanged on a per-wire basis, and the per-transistor leakage power increases sharply with shrinking transistor dimensions.