Absolute surface temperature and air outlet temperature don't mean much, it's missing the most important measurements like the die temperature, and internal temperature around the motherboard. But it shows that the areas sensitive to heat, like the HDD/ODD, are very much under control.
It's counter intuitive, but an efficient heat sink will invariably output hotter air than a less efficient design, as long as the target die temperature is the same. It will need less air flow to remove the same amount of heat. The hard part with a design like the PS4 is getting that hot air out on a path that doesn't heat up sensitive components (like the HDD) and to prevent conduction to slowly accumulate in other areas which don't have any air flow, but the test shows it looks fine even after 3 hours.
The surface of the case is practically touching the heat sink, so it will show up on the FLIR. But there's cold air running between the case and the HDD/ODD, above and below. That's very clever, because it's a laminar flow of the coldest air on the most sensitive components, and even between the motherboard and it's shields. After that, the air goes through the major heat source, then it's isolated inside a shroud up to the exit. It can't heat up the other components by conduction, because there's a layer of cold air to separate them. The Power Supply at the end of the tunnel is by far the least heat-sensitive component so it can use the hotter air, but it still gets an air flow that is proportional to it's own output, since the fan is mostly controlled by the amount of power required.