Heard of this little thing called the CLR?
Just because it runs doesn't mean it runs equally well. If you narrow the architecture you optimize for, you can have significant speed improvements. Particularly if you'll be using SIMD heavily.
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Heard of this little thing called the CLR?
The only variable that might throw that off is leakage. But leakage doesn't remain constant either. The faster your processor, the higher the leakage (exponentially so) since you'll need to run at a leakier process (which Intel does compared to TSMC's LP) and use higher voltage (which Intel does compared to the typical ARM chip).
All in all, it's never more power efficient to use a faster processor. Not even if you can shut down when idle. This is why dual core for parallizable tasks is more power efficient. A processor that's 2x slower actually consumes far less than half the power.
Like I said. The power numbers are coincidentally missing from that slide. It's easy to claim 2x the performance when you eat 4x the power. Of course, the 2W figure is just speculation since we don't have numbers from Intel. Typical Cortex A8 chips at 1GHz consume 500mW or less (with the exception of Hummingbird).
aaronspink said:Leakage isn't frequency dependent but voltage dependent.
aaronspink said:In fact, leakage has little correlation to performance of a silicon device.
This has been proven false in many measurements in many different papers over many different years. Hurry up and sleep has proven to be a more efficient method of computation. Low TDP/Pmax is only important from a thermal and sustained power delivery standpoint and not as a metric for total energy required.
aaronspink said:They are both targeting the same market with roughly the same battery life. And people really need to learn that TDP != power consumed.
Leakage isn't frequency dependent but voltage dependent. In fact, leakage has little correlation to performance of a silicon device.
And FYI, TSMC's process is higher leakage than Intel based on all the documented/reported measurements. In addition, Intel's process has a higher Ion/Ioff ratio than any of TSMC's processes, again according to published and reported data. Data also suggests that Intel's process can support lower Vmin's than TSMC's process too.
This has been proven false in many measurements in many different papers over many different years. Hurry up and sleep has proven to be a more efficient method of computation. Low TDP/Pmax is only important from a thermal and sustained power delivery standpoint and not as a metric for total energy required.
They are both targeting the same market with roughly the same battery life. And people really need to learn that TDP != power consumed.
And pushing frequency is voltage dependent..
Has plenty of correlation when you're measuring amount of power consumed while sleeping, with the "hurry up and sleep" strategy you're promoting.
No, but you can't say that dissipating four times as much heat isn't a reflection on power consumption, I imagine that heat is coming from somewhere...
And pushing frequency is voltage dependent..
No, not really. frequency can be partially voltage dependent, partially RC, partially design, etc.
Leakage has very much to do with performance of a design. Granted one manufacturer's process may simply be superior and have both higher performance *and* lower leakage. But the point you were making was that all else being equal, a faster processor (running at a higher frequency) would consume less power for a given task than a slower processor (running at a lower frequency). This is simply false.
Please provide references. All the data I've seen confirm your second and third point but not your first. TSMC is still using bulk whereas all of Intel's newer nodes are on metal gate. One of the things about metal gate is that leakage is a whole lot worse.
High-κ gate dielectrics and metal gate electrodes are required for enabling continued equivalent gate oxide thickness
scaling, and hence high performance, and for controlling gate oxide leakage for both future silicon and emerging non-silicon
nanoelectronic transistors
Also compare the Ioff numbers for TSMC's LP and TPG processes vs Intel's. They are nowhere near close.
Provide references and details of said comparison.
Again, provide references. We've seen no numbers for Moorestown's power consumption while using the CPU. Saying "roughly the same battery life" is nebulous and meaningless. One can do that through more efficient software, better software/hardware coupling, better battery technology. Hell, a better PCB design or a more efficient screen dimming algorithm will impact battery life dramatically.
Leakage has nothing to do with the performance of a design. When you figure that out, you'll start to understand.
Part of the whole point in going to hi-k/metal gate is orders of magnitude reduction in gate leakage:
Start looking at IEDM papers. TSMC is behind in all aspects and always has been. Then again, why should I expect someone who thinks hik/metal gate causes increased leakage to understand process.