I'll bet my hairy asshole it's going to use good old OPIO link.
I'm not sure that's a prize I would want to win...
It's possible. On thinking about EMIB's ubump interface further, I wonder if that portion of the GPU needs significant customization. The idea would be that the HBM interface would treat the bridge silicon as if it were like any other interposer. The AMD GPU could use a similar or the same HBM2 interface, and with Intel managing the packaging AMD would only need to care about providing an otherwise unremarkable discrete GPU.
If using PCIe or a modified version, that's another section of the GPU that wouldn't need to change much. That would further isolate the GPU from Intel's tech, and simplify what AMD's semi custom engineering would have to handle.
Or it is Radeon division just sticking two fingers up to the CPU division, on another forum quite some time ago was raised there seemed to be some conflict of interest for AMD as a whole with some behaviour from both VPs, more so with the Radeon division.
It would be interesting to hear what the VP of AMD's CPU division thinks of this deal, considering they are really now cut out of a high profit margin sector even before they have the chance to bring a product to that market.
AMD's revenue is split more along the lines of client and enterprise/semi custom.
If this falls under semi custom, it bolsters the segment that is a big target for AMD's long-term growth.
The client side has seen success with Ryzen, the GPU group is whatever from the x86 standpoint, and non-console APUs just don't seem to be garnering much affection.
If AMD's proposed plans are to be believed, the monolithic APUs are going the way of the dodo anyway.
This chip might be for most purposes internally like a special model of discrete, and if semicustom someone else paid for the NRE and is doing all the work in managing the packaging and supply chain. It could be outside AMD's ability to manufacture something along those lines given its likely market penetration, someone paying for the development, and packaging tech.
Without EMIB or a vastly improved business case for a product using interposer/chiplets, I am curious if AMD can make something practical given its limited resources and internal demand.