We all know the nature of the mystery. Whether MS are using creative PR or not is a matter of faith at this point. Can we please keep this thread to possible technical solutions to the mystery.
Because it's potential a complete revolution within the EE sector!! Seriously, they've come up with a BW enhancing feature that no-one can fathom, and they didn't talk about it at all? "Hi guys, welcome to HotChips. Today we'll be talking about games console APU, which is much like any other AMD APU. One special feature we have is that we've found a way to get partial double transfers across a bus boosting bandwidth by 30% or more. I see you're all pretty excited at that prospect! But we won't talk about that. Instead we're going to discuss some conventional specialist processing blocks in there." They didn't present any interesting tech at HotChips, neither their ToF sensor nor how they have achieved something no-one else has achieved for boosting IO BW. I think a lot of us presumed MS would show something more interesting. I don't honestly know why they bothered showing what they did because it doesn't reflect anything of interest within the EE sector. They kept out all the juicy bits.
This is speculation, but if the numbers are true, and MS did develop/discover a (really) special feature, is it not possible that they don't want to share it because they are afraid that other companies will copy it?
Nobody can fathom how it works so, I believe that they really hit a goldmine through their technical engineering, if the numbers add up that is.
(As for the ToF sensor: they would have to mention latencies, which will just be used against them so I understand why they want to keep the specs out of it this time)