I think Sony is targeting 7nm TMSC ans then 6 nm that is an effortless evolution... They go wide and they go bit above 10 TF... I say 10.32 TF
IBM started using 90nm soi in 2004, PS3 launched in 2006, don't remember anymore if the delay was more on cell or more on BD.Didn't PS3 plan to, but miss out because it was late?
Cant be RDNA1 because it lacks things that we know PS5 will include and are inside RDNA2 (Variable rate shading for PSVR2, Ray tracing SFUs...). IMHO RDNA1 is the way AMD took advantage this year to get something in the market to fight Nvidia from its real full next gen design (now called RDNA2) that is designed for 7nm+ process, that probably is more suitable for getting higher clocks.I think Sony is targeting RDNA1 on 7nm TMSC and then on 6 nm that is an effortless evolution already announced... They go wide and they go bit above 10 TF... I say 10.32 TF
As I said they may evaluate to keep compatibility with Stadia's net & server infrastructure just in case MS agreement fails... That means be close, maybe a bit weaker than Stadia 10.7 TF....
Again, and its shocking how many times this needs be repeated, people need to stop fixating on the teraflop number! The next-gen consoles need next-gen visuals and games. If that can be achieved through 9 TFs of next-gen GPU, or 0.1 TF of quantum computing, that's a win!
7nm+ is even better if you want to make the APU smaller (20% higher transistor density, about 10% reduced power consumption). That is my final prediction:Cant be RDNA1 because it lacks things that we know PS5 will include and are inside RDNA2 (Variable rate shading for PSVR2, Ray tracing SFUs...). IMHO RDNA1 is the way AMD took advantage this year to get something in the market to fight Nvidia from its real full next gen design (now called RDNA2) that is designed for 7nm+ process, that probably is more suitable for getting higher clocks.
Next Iphone will already use this year 7nm+ with the A13 SOC.
Of course, but alot of people believe that 40-36CUs at 1800MHz is too little for next gen consoles, but this is hAgain, and its shocking how many times this needs be repeated, people need to stop fixating on the teraflop number! The next-gen consoles need next-gen visuals and games. If that can be achieved through 9 TFs of next-gen GPU, or 0.1 TF of quantum computing, that's a win!
So 500mm2+ SOC and 280W TDP? Doubt it.7nm+ is even better if you make the APU smaller (20% higher transistor density, about 10% reduced power consumption). That is my final prediction:
- 72 CUs RDNA2
- 7nm+
- Conservative clocks (this was PS4 winning strategy): about 1400mhz = 12.9 Tflops
This means the cooling inside a small box (but no smaller than Pro) should be possible with a vapor chamber.
72 cu is definitely not out of the question, seeing as stadia has 56cu, why I’m quoting stadia a lot is because that’s the closest thing we have to next generation Xbox and ps.Of course, but alot of people believe that 40-36CUs at 1800MHz is too little for next gen consoles, but this is h
So 500mm2+ SOC and 280W TDP? Doubt it.
You are comparing completely different architectures. We know Navi with 40CUs is 251mm2, which, coupled with Zen2 will bring your SOC to ~320mm2 without RT hardware that is said to be included.72 cu is definitely not out of the question, seeing as stadia has 56cu, why I’m quoting stadia a lot is because that’s the closest thing we have to next generation Xbox and ps.
Look at how much die sizes have increased over the years. Anything is possible as long as they can cool it and pay for it.
You are comparing completely different architectures. We know Navi with 40CUs is 251mm2, which, coupled with Zen2 will bring your SOC to ~320mm2 without RT hardware that is said to be included.
Basically, 40CU + Zen2 = PS4Pro die size on more expensive node. 40CU + Zen2 + RT hardware = >350mm2 on more expensive node.
There is absolutely no way these new consoles will feature anything north of 56CUs, let alone 72.
Look at my post here and AMDs official performance difference between 9.75TF Navi and 10.5TF Vega.Your probably right, we don’t know and I’m being optimistic, but l do know that die sizes have been increasing a lot over the last few years so comparing dies sizes to last gen is old hat.
Otherwise we would have little performance increases if we stayed with the same die sizes for the last 5 years.
Given RT isn't appearing in AMD's GPUs alongside next-gen hardware, I wonder if there are elements that aren't suitable for a PC solution meaning the tech isn't ready, but which would work in a console? Or at least provide a useful improvement in a console where it wouldn't be particularly useful for a PC? Though I've no idea what form that could take.Sony amd MS were certainly informed of AMD planned future tech, and I can't see anyone of those two chosing to build their own disruptive proprietary tech when they know the industry will go a different direction.