There is a page on a split render target sample, but unfortunately it doesn't have much info. The picture shows about 70% of the render target in ESRAM and 30% in DRAM. That would be the top 20% of the screen and the bottom 10% of the screen in DRAM. They say there typically is not a lot of overdraw in sky and ground. Seems like z, g and colour buffers are all split, but are able to be split differently as needed. Mentions HTile should reside in ESRAM, but I don't know what that is (assuming it has something to do with tiled resources. The tile buffer?).
Well, from here:
http://amd-dev.wpengine.netdna-cdn....012/10/Inside-XBox-One-Martin-Fuller_new.ppsx
there's this mention of HTile:
So it sounds like something to do with "Hardware Tiling" so it's probably talking about the current render-target tile being worked on ...?ESRAM can handle concurrent read/writes:
Operations that can take advantage of this:
Increasing effective bandwidth above 109 GiB/s
- Read modify write operations
- Depth buffer / HTILE update
- Alpha blending
Interestingly, it looks like you could DMA completed tiles out while beginning work on the next with no performance hit, unlike on the 360.
From the above presentation I also liked this, simply because I like anything that makes everything better.
- ESRAM makes everything better
- Render targets
- Textures
- Geometry
- Compute tasks