DavidGraham
Veteran
The whole PCB of the Switch 2 has now leaked with high res pictures, NVIDIA SoC confirmed, 12Gb LDDR5X SK Hynix confirmed, USB-C also confirmed.
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6x the GPU cores, 3x the amount of RAM, 2x the CPU cores. The GPU arch also goes from Maxwell to Ampere, which is a huge IPC gain + new features (Ray Tracing + Machine Learning + DX12U).How "Switch 2" is this versus more "Switch Pro"? Anything on it making it a generational advance? I'm guessing DLSS will mean more direct PC ports making it kind-of SteamDeck-with-bonus-Nintendo-games option.
Also, going from 256 Maxwell cores at a low frequency to 1536 ampere cores at a higher frequency. That's a generational jump. Probably the last one as far as raw power goes for consoles.How "Switch 2" is this versus more "Switch Pro"? Anything on it making it a generational advance? I'm guessing DLSS will mean more direct PC ports making it kind-of SteamDeck-with-bonus-Nintendo-games option.
Samsung has other processes besides 8nm, and ~200 mm^2 should be too small to fit the GPU + 8 core A78 + cache/IO on 8nm. The 12 core AGX Orin has a die size 448mm^2 on that process.Looks like Switch 2 is on the Samsung 8nm process. That's a shame.
Source: the signature on the chip says 'SNW8VF' - the 'SN' referring to Samsung.
There is also an 8 in the signature (SNW8VF), so maybe something like Samsung W(?) 8nm VF(?).Samsung has other processes besides 8nm, and ~200 mm^2 should be too small to fit the GPU + 8 core A78 + cache/IO on 8nm. The 12 core AGX Orin has a die size 448mm^2 on that process.
The "than is needed" is the important bit. Based on the Famiboards analysis, T239 is too big to be reasonably clocked down in portable mode on 8nm. So that suggests Nintendo have a different performance target, otherwise they would have designed a smaller chip. Unless there is a special variant of 8nm with different performance characteristics.Ampere was on Samsung 8nm. It's a matter of not doing more work for a customer than needed.
But nVidia hasnt any design on any other Samsung process. And why would Nintendo pay nVidia to port something to another Samsung process when they could go to TSMC 7nm DUV process?!Samsung has other processes besides 8nm, and ~200 mm^2 should be too small to fit the GPU + 8 core A78 + cache/IO on 8nm. The 12 core AGX Orin has a die size 448mm^2 on that process.
I guess only for cost reasons? But I am not the one pointing to SN in the chip signature. I am just making the point that 8nm doesn't fit either, if the chip is really ~200mm^2 and based on what we know about the power characteristics of the process.But nVidia hasnt any design on any other Samsung process. And why would Nintendo pay nVidia to port something to another Samsung process when they could go to TSMC 7nm DUV process?!
AD107 was 200mm^2 with 2560 Cores and 128bit interface. Dont know why a gaming SoC with 1536 cores and 8 CPU cores could not be possible within the same size.
Well 0.6 of 200 gives 120, so that leaves 80 mm^2 for the CPU and residual IO, or 3.48 billion transistors. But the die size won't scale linearly with the number of SMs, so in practice you would expect to get less space for the CPU. I guess it might be possible after all, but it seems pretty tight.AD107 was 200mm^2 with 2560 Cores and 128bit interface. Dont know why a gaming SoC with 1536 cores and 8 CPU cores could not be possible within the same size.
So you expect Switch 2 to be more powerful than SteamDeck? While simultaneously being thinner and have more battery life?on the cpu and gpu side, switch 2 should be a good notch above PS4, even Quest 3 already is, but still has slower ram though, don't know about ram specs in the switch 2.