"Nerve-Damage"
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Need a better translator...
*BabelFish Snip*
Need a better translator...
*BabelFish Snip*
XDR DRAM finally in the design of the 3rd generation in shipment
The circumstance that it could spend time on verification by the fact that the schedule of PS3 slips is the same concerning the tip/chip around. For example, PS3 is completely new memory, "XDR DRAM" is used in main memory. Rambus develops XDR DRAM, Toshiba, 3 corporations of エルピーダ and Samsung Electronics supply. Because it is the technology whose also XDR DRAM completely is new, it was one of the risk primary factor.
But, with favor of the gap of schedule the DRAM vendor, the development of XDR DRAM, from PS3 came to the point of finishing rather before. Although the tip/chip itself has been completed, it is the case that you have stood by not to insert in real mass production to PS3 production. Depending upon the DRAM vendor, without entering into mass production there is also a place where it moves to the tip/chip design of the 3rd generation.
As for PS3, first it was the expectation which adopts XDR DRAM of the 512Mbit item. At this point in time, it is presumed that of memory sharing architecture was thought, but SCE reconsidered the system, XDR DRAM modified specification to the 256Mbit item. Because of that, the DRAM vendor advanced preceding the design of the 256Mbit item. However, the time where the design of the 256Mbit item completes, requirements specification of SCE side returned to the 512Mbit item again, (around 2004 November). Then, the DRAM vendor deferring the production of the 256Mbit tip/chip, did the design of the 512Mbit item, arranged mass production system. However, because to being in the stage which even 1 year from before is inserted in mass production, the production of PS3 itself does not start, so far as for XDR DRAM you slept.
For example, when エルピーダ is taken as example, the B die/di of 100nm the sample was done from 2005, but after entering into this year, it has moved to C die/di of 90nm. So when it does, 256Mbit 1 generation, as for XDR DRAM which 512Mbit mass-produces in 2 generations becomes the design of 3rd generation. By the fact that process advances, the speed yield which feels concern with XDR DRAM (yield rate) problem, it is the expectation which is rather cancelled in principle.
The fact that schedule is late vis-a-vis Cell and XDR DRAM which precede, is GPU "RSX of the NVIDIA design which development starts from after (Reality Synthesizer)". But, RSX based architecture G70 which NV40 (GeForce 6800) from is really succeeded (GeForce 7800 GTX) is type architecture. Because also 2 years it continued it is the architecture which withers, based architecture itself the risk primary factor is little. Funny perhaps, seeing it is thin, but, certainty is high selection. Of course, if there is a problem at stage of the physical design of the tip/chip, story is another, but either the story such as that is not audible.
As for being visible from such circumstance, the imbalance of of the hard of PS3 and development of the software is. Like the laser of BD, SCE control if the element which cannot be divided was excluded, the individual component of hard advanced at pace of that appearance. Although that it is, software side has not been attached. Although more the resource and approach run period should be provided in development of software layer, as the treatment is late, it is visible. This, is shallow probably is the weak point of SCE whose experience as a software platform company still.