Groo The Wanderer
Regular
nope that had nothing to do with processor design, it was due to poor cooling design.
No, you are wrong, it is the same bump cracking problem as NV has, and could have been cured by a change in underfill, but MS seems to have chosen not to do that, and waited for a full shrink. It is not heat, it is heat cycling once again, but since NV still claims that this is beyond the science of mortal man, I can understand if you hadn't heard that.
ATI designed the ASIC/GPU, and offered to do the layout/physical side of things. MS declined and did it in house. I know several of the guys behind the 360 chips, and they are smart and capable, but I think they had little built up experience with large and hot chips like this, especially on cutting edge processes. I have been told all the details of the failure in painful and exacting details, and all I have to say is that it is thermal stress related bump cracking, not overheating/temperature related failures.
MS did it internally, and taught the industry a lesson. Come companies learned that lesson, others did not.
-Charlie