Now that we know more about Ultra, G84 etc, could we have some updated speculation regarding G90 etc... please!
Heh, why not! (note: those are the wrong codenames)
G91: 4Q07, 192SPs, 2.0-2.6GHz shader domain, 24 TMUs with free trilinear, 16 beefed-up ROPs (stencil enhancements of G84; better blending rates), 750-800MHz+ core clock. 1.4GHz+ GDDR4 on a 256-bit memory bus. 200-240mm² on 65nm. Requires NVIO.
G93: 1H08, 96SPs, 1.8-2.4GHz shader domain, 16 TMUs with free trilinear, 8 ROPs similar to G92's, 700-750MHz+ core clock. 1.2GHz+ GDDR4 on a 128-bit memory bus. 130-150mm² on 65nm, smaller if on 55nm.
G97: 1H08, 48SPs, 1.4-1.8GHz shader domain, 8 TMUs with free trilinear, 4 weaker ROPs, 600-650MHz+ core clock. DDR2/DDR3 on a 64-bit memory bus. 70-85mm² on 55nm.
MCP78: 1H08, 24SPs, 1.2-1.4GHz shader domain, 4 TMUs with free trilinear, 2 weaker ROPs, 550-600MHz+ core clock. 50-60mm²(+NB+SB) on 55nm. Will use 8MiB+ eDRAM. Total chip around 120mm².
I would tend to believe all G9x derivatives will be based on the low-power process variant due to different custom design rules. 55nm-LP at TSMC will become available in Q3 and will be a pure optical shrink (analogue will scale too, apparently!). This also puts UMC and Chartered out of the picture, most likely...
Please note that this is, once again, mostly speculation. The goal is to come up with realistic estimates for the target die sizes, really. As for the roadmap beyond these parts, it'll be interesting to see if they optically shrink the 192SPs part to 55nm or not. I would expect them to, really, as a 6-months-refresh before the 45nm part in 4Q08 or so.