Sage said:
DDRII is a go.
oh and 1.5 years is way off. at its heart, its quite old.
450MHz is best case scenerio.
TSMC $ux0rz...
has everyone forgotten about UMC and IBM?
I like how you summarize your opinion of TSMC in a 2 word sentence! I want to challenge that...
From
http://www.eetimes.com/story/OEG20011129S0040,
NVidia reportedly manufactured some NV2A (X-Box GPU) engineering samples on UMC's 0.15 fab, so perhaps NVidia already has future plans with UMC. (At this point, I think TSMC has more 0.13 capacity than UMC, but UMC is still a worthy alternative.)
IMHO, IBM is a long shot. Although their foundry technology is among the most advanced, here are some practical reasons which make IBM less attractive.
1) IBM's chip-design environment is *very* different from TSMC/UMC. (TSMC and UMC both export their foundry characteristics to library vendors, who encapsulate their foundry characteristics into 'tool views,' which can be loaded in 3rd-party EDA packages like Avanti Apollo, Cadence SE/PKS, Synopsys Design Compiler, etc.) In order to re-target the NV30 for IBM's foundry, NVidia's engineers basically have to re-learn a bunch of IBM's proprietary in-house tools. And/or trust IBM's design services group to perform a large portion of back-end layout work. (See
http://www-3.ibm.com/chips/products/asics/methodology/design_flow.html - notice how many rows are *exclusively* IBM-only tools?)
Note, this isn't to say that design-flow (custom-owned tooling) vs (foundry-in-house tooling) is *better* than the other. TSMC/UMC offer *no* in-house design-services, so consequently, third-party CAD tools support their entire design-process. Companies like AMD, Intel, and IBM use their foundries as a means to make their core products (CPU, flash memory, etc.) Intel and IBM perform a tremendous amount of semiconductor basic research. They leverage that investment by writing their own CAD-tools/algorithms, and deploying them in their production fabs. Because NVidia has been a TSMC customer for some time, they are likely more comfortable with a custom-owned-tooling (COT) design flow.
2) IBM's pricing is less competitive than TSMC/UMC. IBM's merchant-foundry operation competes with IBM's other internal division customers (like their microprocessor group.) IBM generates the highest per/wafer income by selling its *own* silicon products (PowerPC chips, etc.), not by selling manufacturing capacity to third-parties. This is just another way of saying that IBM's core/primary business is selling chip products, and its foundry-business is a secondary priority. For that reason, IBM's pricing isn't likely to compete with pure-play foundries like TSMC and UMC. (On the other hand, IBM's superior process characteristics might justify their higher cost structure. For example, Xilinx has chosen IBM to manufacture its flagship Virtex-2 Pro FPGA.)
Unfortunately, none of the foundries named in this post publicly advertises his/her pricing structure (you must sign an NDA), so I can't directly prove this.
I can think of 1 other reason, but I can't even justify it to myself, so I'll leave it out.
Here's another relevant article
http://www.eetimes.com/story/OEG20020624S0042. It tries to explain IBM's business-direction (in terms of the merchant foundry market.)