Just saw this blurb about the damage so thought I'd share it.
From Xbit -- http://www.xbitlabs.com/news/memory...nix_DRAM_Plant_More_Series_Than_Expected.html
From Xbit -- http://www.xbitlabs.com/news/memory...nix_DRAM_Plant_More_Series_Than_Expected.html
SK Hynix’s Chinese Plant May Delay Shipments by Months
Although SK Hynix said last week that the fire did not destroy crucial manufacturing equipment during the fire at Fab 1 and Fab 2 in Wuxi, China, it looks like the things are more complicated. While some of the manufacturing tools were not damaged during the fire, a lot of equipment has been harmed. All in all, it is going to take months before shipments resume, according to DRAMeXchange market analysts.
With the fire originating from within the clean room, the difficulty of recovering the affected half of the capacity in the short term – assuming both the equipment and clean rooms were heavily damaged – are also relatively high. Sources with close knowledge of semiconductor equipment have so far indicated that the recovery process could take as long as three months to half a year to complete. To facilitate the entire process, SK Hynix has sent up to hundreds of professionals and engineers to visit the accident site and to assess the situation more carefully.
Once the damages at the Wuxi Plant are clarified, the DRAM industry is projected to be in for a series of major challenges.
The SK Hynix Wuxi plant reconfiguration and manufacturing delays, in particular, will likely impact at least two months roughly 260 thousand worth of wafer production.