To get the disclaimers out of the way, this information comes from The Inquirer, so really there's no humanly way of knowing whether this is one of their BS stories or not. That said, it seems like it's not, but whatever...
Anyway acording to this article of theirs, presently IBM is yielding about 65 'good' Cell chips per wafer. Me and others have previously counted the die candidates on a wafer and reached 228 as the number of possible chips; thus at present if the 65 number is to be believed, the present yields are in the ~29% range. With an (Inquirer stated) total wafer processing cost of roughly $10,000 per wafer, this gives a pre-packaging cost of around ~$154 per chip.
Well, the Inquirer then goes on to talk about the price effect on PS3, blah blah blah...
But rather, I think they missed an important point of the 65 'good' Cell chips almost assuredly refering to perfect dies, whereas the PS3 will be utilizing chips with up to one SPE defective. So clearly if these numbers are true the cost to Sony for the PS3 will not be as high as that $154 per chip (pre-packaging of course), but rather some lower number.
Is there a means via which we could estimate how many more die candidates we might receive from a wafer at the present yields with single-SPE defective dies included? I know there is an equation to calculate roughly the estimated die defects on wafer and their spread, but I don't know it myself. (hint hint)
Though on a large die such as that for Cell it's hard to estimate how much of a gain in yield percentage we might be able to expect in the next several months pre-65nm, certainly some gain though should be expected - again aiding the situation of the chips cost.
Anyway thought this was interesting info; it of course depends wholly on the veracity of the Inq's 'information,' but it's the closest we've gotten thus far to a true snapshot of the Cell's present state of fabbing and cost.
Picture thrown in for dramatic effect.
Anyway acording to this article of theirs, presently IBM is yielding about 65 'good' Cell chips per wafer. Me and others have previously counted the die candidates on a wafer and reached 228 as the number of possible chips; thus at present if the 65 number is to be believed, the present yields are in the ~29% range. With an (Inquirer stated) total wafer processing cost of roughly $10,000 per wafer, this gives a pre-packaging cost of around ~$154 per chip.
Well, the Inquirer then goes on to talk about the price effect on PS3, blah blah blah...
But rather, I think they missed an important point of the 65 'good' Cell chips almost assuredly refering to perfect dies, whereas the PS3 will be utilizing chips with up to one SPE defective. So clearly if these numbers are true the cost to Sony for the PS3 will not be as high as that $154 per chip (pre-packaging of course), but rather some lower number.
Is there a means via which we could estimate how many more die candidates we might receive from a wafer at the present yields with single-SPE defective dies included? I know there is an equation to calculate roughly the estimated die defects on wafer and their spread, but I don't know it myself. (hint hint)
Though on a large die such as that for Cell it's hard to estimate how much of a gain in yield percentage we might be able to expect in the next several months pre-65nm, certainly some gain though should be expected - again aiding the situation of the chips cost.
Anyway thought this was interesting info; it of course depends wholly on the veracity of the Inq's 'information,' but it's the closest we've gotten thus far to a true snapshot of the Cell's present state of fabbing and cost.
Picture thrown in for dramatic effect.
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