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Let's hope these geeks do the unthinkable: hogtie poor, hapless Cell to the railroad tracks before commandeering a freight train, the Optical Express, to barrel inexorably toward it ...
IBM Technology could make optical chip connections a reality
IBM today announced it has developed a high-speed photodetector that could greatly increase the speed at which information travels to and from microchips, boosting performance in computers and other types of electronic systems.
June 21, 2004, Mumbai: While the performance of microprocessors and other chips has increased dramatically, bottlenecks still exist in getting information to and from the chip. The new photodetectors could relieve those bottlenecks by allowing chips to talk with the other parts of an electronic system using high-speed light pulses and optical connections instead of the relatively slow electrical pulses and wires used today.
While optical connections have long been recognized as a potential avenue for increasing chip communications, prior attempts to incorporate this capability were incompatible with chip manufacturing processes. IBM's photodetectors are based on a newly-developed germanium-on-insulator (GOI) technology that could now, for the first time, allow them to be readily incorporated into many standard chips.
"This is a major step toward overcoming the biggest bottleneck in system performance, the interconnection between chips," said T.C. Chen, VP Science and Technology, IBM Research. "Opto-electronic components such as these GOI photodetectors will be essential for future high-performance computing systems."
Source: Public Relations Domain
IBM Technology could make optical chip connections a reality
IBM today announced it has developed a high-speed photodetector that could greatly increase the speed at which information travels to and from microchips, boosting performance in computers and other types of electronic systems.
June 21, 2004, Mumbai: While the performance of microprocessors and other chips has increased dramatically, bottlenecks still exist in getting information to and from the chip. The new photodetectors could relieve those bottlenecks by allowing chips to talk with the other parts of an electronic system using high-speed light pulses and optical connections instead of the relatively slow electrical pulses and wires used today.
While optical connections have long been recognized as a potential avenue for increasing chip communications, prior attempts to incorporate this capability were incompatible with chip manufacturing processes. IBM's photodetectors are based on a newly-developed germanium-on-insulator (GOI) technology that could now, for the first time, allow them to be readily incorporated into many standard chips.
"This is a major step toward overcoming the biggest bottleneck in system performance, the interconnection between chips," said T.C. Chen, VP Science and Technology, IBM Research. "Opto-electronic components such as these GOI photodetectors will be essential for future high-performance computing systems."
Source: Public Relations Domain