Maybe they threw out the CFX-port, added two or one additional cluster and did some floor plan optimization to end up at 205mm^2 at 55nm.
Back in October, there were some rumors about a 205mm² 1.5TFLOPs(what would be RV790s ~850MHz @880-960SPs) GPU:
http://translate.google.ch/translat...rv870-neue-details&sl=de&tl=en&hl=de&ie=UTF-8
That's just a reckless guess, ignoring routing. As to scheduling, I still haven't worked out how this is configured across the die - i.e. how much scheduling is within a cluster and how much is outside...Is that really just so easy? No extra wiring, no extra space taken up by the scheduler, no increased complexity in data paths to and fro?
I'd be really disappointed if they launched a new chip on 40 nm w/o any increase in shader count. IIRC, rv7xx was pad limited so it would be wasting die space if it wasn't increased.
I don't even know what track I'm onWell, TBH, the specu posted earlier makes me think Jawed may be along the right track.
The 3 leadoff 40nm chips are - RV740, GT216 and GT218. Not sure what else comes after, amd also needs something to replace their igp, also i swear i read last week somewhere jsen huang let it slip ion would dx11 before the end of the year(will spend rest of today looking for this link ).For what it's worth, the rumours are for more than one 40nm chip. Has "RV720", RV710's replacement, ever been mentioned? If not, then doesn't that make RV790 likely to be the other chip an 40nm?
The rumor i heard was ~290mm2, that was last year. Wasn't sure if the extra size was due to the change from 55GP to GT or they had added extra units. Sorry is not 40nm, the vr-zone link said 1.3V above TSMC's 1.2V max for 40nm...exceeded on the first chip, doesnt seem very probable.205mm2, say 16 clusters, 1280 ALU lanes, ~2.2 TFLOPs with a 256-bit bus and no change to the RBEs.
i swear i read last week somewhere jsen huang let it slip ion would dx11 before the end of the year(will spend rest of today looking for this link ).
JHH said:I don’t really know if they are or not. They haven’t told me. Our focus is to build the most amazing products that the world has seen, and hopefully surprise the industry with what we can achieve. We’ve always believed that the GPU is becoming more important. With Ion, we’ve brought Cuda, Open CL, and DirectX 11 all the way down to the most cost-effective platforms in the world. This is a really good platform for consumers. Customers and consumers are well served by having this platform.
For what it's worth, the rumours are for more than one 40nm chip. Has "RV720", RV710's replacement, ever been mentioned? If not, then doesn't that make RV790 likely to be the other chip an 40nm?
205mm2, say 16 clusters, 1280 ALU lanes, ~2.2 TFLOPs with a 256-bit bus and no change to the RBEs.
Jawed
alu count seems reasonable, but memory bandwidth seems to have very little growth compared to rv770, when it was already texturing limited in certain games.
This makes me wonder, could amd decide to implement some edram (ie xenos like) stuff on future stuff (may be not rv790/740 but on rv8xx perhaps or may be even later), that would relieve a lot of bandwidth requirements. It could be on die if necessary and since display resolutions don't grow as fast as moore' law, the cost could be manageable/negligible in not too distant future.