Actual picture of RSX chip

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wireframe said:
Guden Oden said:
I don't want to claim for sure this is fake, but I think it is.

Top pic, there's a rounded corner on the chip package (upper left; the one marked with a dot).

Bottom pic doesn't seem to have a rounded corner.

Well spotted!

However if you look at the top picture, left bottom corner, you can see the square edge under it, almost in the shadow. The curved silver portion does not cover the entirety of the green portion. That's why when it's turned over it looks different.
 
I think it just goes back to the point of, everything else aside, would it even be possible to have a silicon sample of RSX yet?

And if not (which is my own take - assuming future tape-out), is there any practical purpose to having a 'proxy chip' made for development reasons over at PS3 HQ?

We're looking at real chip packaging, no doubt there I think - but just because it has 'RSX' on it doesn't mean we understand what exactly we're looking at.
 
Daisychain refers to the ability for RSX to scale in tandem with CELL for PS4, PS5, PS6 etc. You will see multiple CELLs and multiple RSXs daisychained inside future generation Playstations...
 
PC-Engine said:
Daisychain refers to the ability for RSX to scale in tandem with CELL for PS4, PS5, PS6 etc. You will see multiple CELLs and multiple RSXs daisychained inside future generation Playstations...

I'm not 100% sure if that's a good thing or a bad thing...
 
london-boy said:
PC-Engine said:
Daisychain refers to the ability for RSX to scale in tandem with CELL for PS4, PS5, PS6 etc. You will see multiple CELLs and multiple RSXs daisychained inside future generation Playstations...

I'm not 100% sure if that's a good thing or a bad thing...

and above all , hightly speculative...
I'll stick on the definition and pics i did found. :D
 
london-boy said:
I'm not 100% sure if that's a good thing or a bad thing...
It's clearly a bad thing. Similar to, though not quite as bad, as the 16 to 32 PS2 idea.

By the time the PS4 is upon us, no developer will want to work on the RSX save for PSP2 work.
 
Inane_Dork said:
london-boy said:
I'm not 100% sure if that's a good thing or a bad thing...
It's clearly a bad thing. Similar to, though not quite as bad, as the 16 to 32 PS2 idea.

By the time the PS4 is upon us, no developer will want to work on the RSX save for PSP2 work.

I was thinking the same thing.

More of the same, just faster and bigger, or new features new techniques new philosophy? :D
 
The pin layout is a little different, obviously. But I think both pictures are genuine. RSX seems to be a little larger, atleast the package is. I think this is because of the cooling methods they plan to use: G70 will use a large vented heatsink that forms a "wind tunnel" over the CPU, while RSX will probably use a block heatsink with a fan on top of it (like the first PS2s did).
 
The logic is sound, but still - RSX hasn't taped out yet; this is a fact that cannot be shunted aside. Maybe those are the G70 chips that are being put into PS3 dev kits presently as placeholders? :?
 
BOOMEXPLODE said:
back of RSX
The pin layout is a little different, obviously.
Should be more than just a little though, considering RSX will only have 128-bit memory I/F. That's upwards of 300 pins less on the package, if not more, with all the extra power and grounds needed to balance the signal pins.

And there's still a missing rounded corner on the bottom picture. If it was up to me to decide, I'd say it's a fake so talking about pins and shit on a fake is just a waste of time.

I think this is because of the cooling methods they plan to use: G70 will use a large vented heatsink that forms a "wind tunnel" over the CPU, while RSX will probably use a block heatsink with a fan on top of it (like the first PS2s did).
What are you talking about?

PS2 never ever used a cooler like that; early gen PS2 had a die-cast aluminium pin/fin cooler with a heatpipe baked into it. Xbox did however have a traditional hsf stuck on top of the GPU. And you can be sure there won't be a lump of metal with a fan on top in PS3 either; where would it fit? The casing's so narrow! The only reasonable solution will be some sort of cross-flow cooling arrangement.
 
Guden Oden said:
BOOMEXPLODE said:
back of RSX
The pin layout is a little different, obviously.
Should be more than just a little though, considering RSX will only have 128-bit memory I/F. That's upwards of 300 pins less on the package, if not more, with all the extra power and grounds needed to balance the signal pins.

Less pins from having a 128bit bus
More pins for the Flex IO

cheers
Gubbi
 
FlexIO is a low pincount bus interface. I really doubt it requires (many) more pins than PCIe 16x. Certainly not anywhere the amount that a 128-bit DDR3 I/F does.
 
i count the pins in the RSX and G70 photo, G70 win (probably because 256bit GDDR bus vs 128 bit GDDR bus)

RSX: 1069 pins
G70: 1148 pins
 
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