Jaws said:Maybe some nanotech cooling fins! 8)
But then where are the pins? On the other side of the chip?
Fredi
Jaws said:Maybe some nanotech cooling fins! 8)
That coin should have a 26.5 mm diameter. Coin area should be about 550 mm2Fafalada said:So someone familiar with dimensions of a dollar coin please whip up the die area figure, stat! 8)
McFly said:Jaws said:Maybe some nanotech cooling fins! 8)
But then where are the pins? On the other side of the chip?
Fredi
So there are... other places.... with creatures that live beyond our borders?HappyBread said:Titanio said:Cheers Happy! Can I ask where did you find these?
Some IBM employee at Gamesradar.com. He has some presentation and he posted these on the forums.
I've just had the full details drop in to me, also a few fancy slide shows that'll be screened to the press etc.
http://forum.gamesradar.com/viewforum.php?f=12
Ok, after looking at the picture, I can discern that the shorter side of the chip rectangle is exactly half the diameter (13.25mm), and longer is about 0.8399060% of the diameter (I have very sharp eyes), giving me 22.257508 mm.nAo said:That coin should have a 26.5 mm diameter. Coin area should be about 550 mm2
At least it will be funny to see how our super-accurate measures are off record once the real die area will be publicFafalada said:OMG CELL has a die area of 294.912 mm2
OMG CELL has a die area of 294.912 mm2
Is that much or little
Emh..cough...Have you actually measured your chock chips?V3 said:I don't know my coin dimension, but I know my choc chips And I'll second that (Unless they have smaller chock chips over there)
Jaws said:I can't see pin shadows against that coin...
So equivalent to more than 17x17mm - that's a big one.Fafalada said:OMG CELL has a die area of 294.912 mm2
Die size in 90um: 206mm^2
David Wang wrote:
The CELL processor presented has 1 64b PPC core acting as the traditional scalar processor, complete with its own L2. The PPE (PowerPC processing Element) is connected to 8 other SPE's (Synergistic Processing Elements) The SPE's are the magic glue that is suppose to contain enormous amount of compute power and a bunch of them gets you the enormously large flop rating that we've all head much about.
Some stats.
1. 90nm SOI process.
2. Logic depth is functionally equivalent to about 20 FO4 (est), but circuit speed equivalence is 11 FO4 per stage. The short pipestage circuit depth is reached with "circuit efficiencies" and Dynamic logic !?!
3. With per stage delay of 11 FO4, the schmoo plots show that the SPE's can crank from 3.2 GHz @ 0.9V Vdd to 5.2 GHz @ 1.3 V Vdd. The entire chip has similar frequency/voltage range, but to get to 5.2 Ghz @ 1.3V, each SPE will eat 11~12W. Add in the rest and the chip will get really hot. 4 GHz @ 1.1V = 4W per SPE seems to be the nominal range.
4. Die size per SPE is 2.5 x 5.81 mm^2. The entire chip with 8 SPE's seems to be about 17.2 x 12 mm^2. That seems to be an awfully large chip for IBM. The CPU to be used in PS3/Xbox2 will probably be the 65nm version or it'll have to have fewer SPE's.
6. As previously announced, the off chip I/O interface is Rambus Redwood and the memory interface is XDR. Similar clocking/deskewing schemes. Looks to be about ~50 GB/s BW to memory, and 50~100 GB/s to I/O.
I'll write up articles as the papers are presented.
The CPU to be used in PS3/Xbox2 will probably be the 65nm version or it'll have to have fewer SPE's.
V3 said:Die size in 90um: 206mm^2
Guess I forgot my choc chip are supersize
Pretty much expected die size for 90nm Cell.