GTC Keynote states that is had NVLINK (a new GPU-GPU link) and 3D Memory (Stacked DRAM).
Is this GPU a replacement or renamed Volta?
CPU - GPU link
NVIDIA will add NVLink technology into its Pascal GPU architecture -- expected to be introduced in 2016 -- following this year's new NVIDIA Maxwell compute architecture. The new interconnect was co-developed with IBM, which is incorporating it in future versions of its POWER CPUs.
"NVLink enables fast data exchange between CPU and GPU, thereby improving data throughput through the computing system and overcoming a key bottleneck for accelerated computing today," said Bradley McCredie, vice president and IBM Fellow at IBM. "NVLink makes it easier for developers to modify high-performance and data analytics applications to take advantage of accelerated CPU-GPU systems. We think this technology represents another significant contribution to our OpenPOWER ecosystem."
With NVLink technology tightly coupling IBM POWER CPUs with NVIDIA Tesla® GPUs, the POWER data center ecosystem will be able to fully leverage GPU acceleration for a diverse set of applications, such as high performance computing, data analytics and machine learning
Turns out Volta remains on the roadmap, but it comes after Pascal and will evidently include more extensive changes to Nvidia's core GPU architecture.
Nvidia has inserted Pascal into its plans in order to take advantage of stacked memory and other innovations sooner. (I'm not sure we can say that Volta has been delayed, since the firm never pinned down that GPU's projected release date.) That makes Pascal intriguing even though its SM will be based on a modified version of the one from Maxwell. Memory bandwidth has long been one of the primary constraints for GPU performance, and bringing DRAM onto the same substrate opens up the possibility of substantial performance gains.
Compared to today's GPU memory subsystems, Huang claimed Pascal's 3D memory will offer "many times" the bandwidth, two and a half times the capacity, and four times the energy efficiency. The Pascal chip itself will not participate in the 3D stacking, but it will have DRAM stacks situated around it on the same package. Those DRAM stacks will be of the HBM type being developed at Hynix. You can see the DRAM stacks cuddled up next to the GPU in the picture of the Pascal test module below.
Where previous POWER processors use the GX++ bus for external communication, POWER8 removes this from the design and replaces it with the CAPI port (Coherence Attach Processor Interface) which is layered on top of PCI Express 3.0. The CAPI port is used to connect auxiliary specialized processors such as GPUs, ASICs and FPGAs.[5][6] Units attached to the CAPI bus can use the same memory address space as the CPU. At the 2013 ACM/IEEE Supercomputing Conference, IBM and Nvidia announced an engineering partnership to closely couple POWER8 with Nvidia GPUs in future HPC systems.[7]
YesI thought I heard him make reference to "sitting on a wafer"
MfA said:I wonder who NVIDIA is working with for the memory. Hynix too? HBM seems the only wide IO memory which will be ready soon (HMC is not wide IO memory).
I wonder who NVIDIA is working with for the memory. Hynix too? HBM seems the only wide IO memory which will be ready soon (HMC is not wide IO memory).
PS. guess they might be doing it with eDRAM at IBM ... expensive, but hell that silicon interposer is probably a 1000$ all by itself.
I wish these companies would be more forthcoming with HBM details.
Well that's good to hear.It is indeed Hynix HBM. I confirmed this talking a Hynix rep at GTC. It may be that Pascal uses 2nd gen HBM, which would give 1TByte/sec throughput. This would match with Jen-hsun's rough numbers.