I didn't know where to put this, so I guess it's time to start a new topic...
It's a new Nvidia patent about Face-to-Face dies with enhanced power delivery using extended TSVs:
https://www.freepatentsonline.com/20210233893.pdf
For reference, previous 2017 Nvidia Multi-Chip-Module GPU whitepaper:
https://research.nvidia.com/publication/2017-06_MCM-GPU:-Multi-Chip-Module-GPUs
Hopper is the new Nvidia datacenter multi-die GPU that will be sold in module with the companion Grace ARM CPU
It will arrive few quarters after AMD MI200 and before MI300...
It's a new Nvidia patent about Face-to-Face dies with enhanced power delivery using extended TSVs:
https://www.freepatentsonline.com/20210233893.pdf
For reference, previous 2017 Nvidia Multi-Chip-Module GPU whitepaper:
https://research.nvidia.com/publication/2017-06_MCM-GPU:-Multi-Chip-Module-GPUs
Hopper is the new Nvidia datacenter multi-die GPU that will be sold in module with the companion Grace ARM CPU
It will arrive few quarters after AMD MI200 and before MI300...