That would come at a noticeable performance loss, though.If you really wanted to, you could serialize the ECC bits and stick with a "normal" bus width.
Code:DDDDE DDDDE DDDDE DDDDE becomes EEEE DDDD DDDD DDDD DDDD
But still noticeable. As I said.A 1/8th bandwidth reduction is hardly going to break the bank.
The overall bandwidth overhead for the ECC bits is exactly the same. You're only getting there through frequency, not by using a wider bus.That would come at a noticeable performance loss, though.
True, but it's likely more difficult (though perhaps less expensive) to drive the bus at a higher frequency than construct a wider bus.The overall bandwidth overhead for the ECC bits is exactly the same. You're only getting there through frequency, not by using a wider bus.
You can only do that if it fits the burst characteristics of the memory.If you really wanted to, you could serialize the ECC bits and stick with a "normal" bus width.
Code:DDDDE DDDDE DDDDE DDDDE becomes EEEE DDDD DDDD DDDD DDDD
If you really wanted to, you could serialize the ECC bits and stick with a "normal" bus width.
Code:DDDDE DDDDE DDDDE DDDDE becomes EEEE DDDD DDDD DDDD DDDD
That may be more related to power consumption/heat than reliability.They are already sacrificing a bit of bw for avoiding errors. Tesla has a bw of ~102GBps while gtx 280 has a bw of 141 GBps.
With serialization like that you either end up with odd memory sizes or require special memory chips.
In addition, you would either need chips that support x9 burst sizes or take up 2 burst slots. Nominal burst length is 8x while chop burst length is 4x.
I'm still partial to cherry picked DDR3 if they want to implement ECC personally. Solves two birds: ECC and capacity but gives up bandwidth.
Why?I'm not sure it woudl be fesible to do implement it that way on a gaphics card.
On a graphics card the bus is devided into several smaller busses with perhaps one or two chips per bus.
Adding another chip per bus for ECC would lead to too much overhead.
Why?
There's no question that ECC would take more board real estate. But there's no reason to believe that it would be too much.
I think you're vastly overestimating the difficulty here. Yes, it will be a challenge. Yes, the board would have to be redesigned. Yes, it would probably end up being a significantly larger board, perhaps with even more layers than a non-ECC part. All this makes it more expensive: it doesn't make it impossible. And for the prices that professional cards go for, more expensive isn't too tremendous a barrier.The GT200 has a 512 bit bus with 16 chips, i.e. 32 bits per chip, lets assume that next gen won't go lower.
Lets assume that you want to do your ECC encoding so that your ECC is 36 bits for each 32 bits of data. Thats a increase of 1/8, which sounds acceptable.
The problem comes when you are to organize your buses, two 288 bit (256 data) buses woudl fit, but then you would have to tocuh all nine chips when you read or write.
We have seen that the busses on graphics cards are quite small to be as effective as possible and I don't see a viable solution if you don't want to increase your bus width and if you don't want to add more than 1/8 overhead.
But hey, I'd like to be proven wrong.
I think you're vastly overestimating the difficulty here. Yes, it will be a challenge. Yes, the board would have to be redesigned. Yes, it would probably end up being a significantly larger board, perhaps with even more layers than a non-ECC part. All this makes it more expensive: they doesn't make it impossible. And for the prices that professional cards go for, more expensive isn't too tremendous a barrier.
They are already sacrificing a bit of bw for avoiding errors. Tesla has a bw of ~102GBps while gtx 280 has a bw of 141 GBps.