It's amazing how Charlie can take interesting raw info and turn it out into incoherent gibberish. First of all, has he still not learned that A11 is the first tape-out for both NV and AMD's GPU divisions, and not A0?
Secondly, he clearly doesn't understand that you can start mass production before the samples are back. So here's a more correct timeline if they're willing to pay the big bucks to get it done:
- Week 0: Tape-out, initiate hot batch production for a few wafers + mass production for many wafers stopping at a certain stage of the process, allowing for a metal respin.
- Week 8: Hot batch samples received (A11).
- Week 10: Testing completed, bugs found.
- Week 12: Bugs fixed via metal layer respin, finish mass production for already started wafers. Also hot batch a few for driver devs etc.
- Week 18: Hot batch samples received (A12), do testing & final driver R&D.
- Week 20: Mass production samples received, ready to ship to AIBs.
Shock horror, that's exactly mid-October and I didn't even have to fudge with any of my numbers to get there; they are far from accurate, but I'm pretty confident they're not too far off either. Of course, there's a risk with this: if there's a major bug and a silicon layer respin is required to fix it, they're effectively toast and they just got for potentially tens of millions of dollars worth in wafers to send to the trashcan. That's one of the reasons why this kind of thing isn't usually done, but clearly NV seems to think GT300 is so important to the company's future that they need to get it out ASAP.
Oh BTW, here's a hint to Charlie: 8 weeks from June 1 is not August 1. It's July 27th. Sigh... (of course, you could argue that's compensated by the fact he assumed June 1 instead of, say, June 15)
Secondly, he clearly doesn't understand that you can start mass production before the samples are back. So here's a more correct timeline if they're willing to pay the big bucks to get it done:
- Week 0: Tape-out, initiate hot batch production for a few wafers + mass production for many wafers stopping at a certain stage of the process, allowing for a metal respin.
- Week 8: Hot batch samples received (A11).
- Week 10: Testing completed, bugs found.
- Week 12: Bugs fixed via metal layer respin, finish mass production for already started wafers. Also hot batch a few for driver devs etc.
- Week 18: Hot batch samples received (A12), do testing & final driver R&D.
- Week 20: Mass production samples received, ready to ship to AIBs.
Shock horror, that's exactly mid-October and I didn't even have to fudge with any of my numbers to get there; they are far from accurate, but I'm pretty confident they're not too far off either. Of course, there's a risk with this: if there's a major bug and a silicon layer respin is required to fix it, they're effectively toast and they just got for potentially tens of millions of dollars worth in wafers to send to the trashcan. That's one of the reasons why this kind of thing isn't usually done, but clearly NV seems to think GT300 is so important to the company's future that they need to get it out ASAP.
Oh BTW, here's a hint to Charlie: 8 weeks from June 1 is not August 1. It's July 27th. Sigh... (of course, you could argue that's compensated by the fact he assumed June 1 instead of, say, June 15)