http://www.eetimes.com/news/semi/sh...FSBWS0QSNDBCSKHSCJUMEKJVN?articleID=163701578
NEC doubles plan at 300-mm fab launch
Yoshiko Hara
EE Times
(05/27/2005 5:57 AM EDT)
TOKYO — NEC Electronics Corp. has officially celebrated the launch of its 300-mm wafer fab at Yamagata and has started to ramp its manufacturing capacity towards 20,000 wafers a month. The fab is scheduled to make an embedded graphics chip for inclusion in Microsoft's Xbox 360 game console and the chip is expected to be one of the fab's first major products.
The 20,000 wafer per month figure is double the manufacturing capacity of an original plan announced in April 2004.
The fab, at NEC Electronic's wholly-owned semiconductor manufacturing subsidiary in Tsuruoka city, Yamagata prefecture in the northern part of Japan, is designed to join a newly-built B fab to an existing A fab and 300-mm wafer production is due to expand from the A fab to the B fab. The company said that the fab could be flexibly expanded depending on the demand. The 300-mm line, which started operation last December at the existing A fab with a monthly capacity of 4,000 wafers, is equipped with facilities for 130- and 90-nanometer manufacturing processes. With the official launch, the company said it plans to expand into the new B fab to reach 6,000 wafers a month by September.
NEC Electronics has invested about 80 billion yen (about $742 million) on the 300-mm fab in the last fiscal year and plans to add another 50 billion yen (about $464 million) in this fiscal year.