Samsung 2nm process

I want to see it. It's going to be the only mobile RDNA4 launch, and despite headlines RDNA in Exynos has matched Qualcomm's offerings every single year (you need to set power limits to be the same for comparing otherwise identical phone chassis, duh).

I'm not quite so sure it will be RDNA4 as IP may not have been ready in time for the SoC. So it might be RDNA 3.5, AMD mentioned that they leveraged their collaboration with their mobile partners and optimized for power efficiency.
 
 
As per Ming Chi Kuo, Qualcomm may be the sole supplier for the Galaxy S25 as Samsung may not use the 3nm Exynos 2500 due to low yields
ASML has royally screwed the pooch, TSMC is the only one with the pellicle technology to actually make their machines work.

All the other process improvements are just fucking around in the margins as long as they can't match TSMC pellicles.
 
ASML has royally screwed the pooch, TSMC is the only one with the pellicle technology to actually make their machines work.

All the other process improvements are just fucking around in the margins as long as they can't match TSMC pellicles.

How is that ASML's fault? Pellicles are made by the foundry right.

And Samsung has been using EUV from 7nm, and while they might not have matched TSMC initially, the latest 4nm process almost does. So what is wrong with their pellicles?
 
It has been confirmed that Samsung Electronics has completely postponed the start of construction and orders for its 4th factory in Pyeongtaek (P4) and the 2nd Taylor Foundry factory in Texas, USA. It is interpreted that Samsung Electronics has chosen a conservative approach to semiconductor investment, and it is expected to have an impact on the ordering schedules of its partners.
 
How is that ASML's fault? Pellicles are made by the foundry right.
ASML developed pellicles which Mitsui now sells, TSMC uses their own. Samsung is also trying to develop its own.

Even though the mere suggestion sends ASML engineers into conniptions, I think it's possible TSMCs pellicles are active components. If you can electrostatically charge the tin debris, preferably before it hits the pellicle, you might be able to keep it away from the pellicle in the first place. Even debris on the pellicle can cause problems.
 
Plasma debris is much more likely to contaminate the optics, rather than the mask or pellicle. Mask contaminants are much more likely to be larger particles that make their way into the scanner. Plus, you don't always need to run a pellicle depending on what you're making.

You're talking like fancy pellicles are the only way to make leading edge nodes yield well.
 
TSMC is the only way to make leading edge nodes yield well, since the introduction of EUV.

The processing after exposure didn't see massive changes, unless Samsung suddenly became less competent that leaves some novelty in TSMC's EUV mask creation or their pellicles as the likely distuingishing factor, that's where the room is for in-house innovation in EUV. Their lead was too sudden and persistent to just chalk it up to skill.
 
The Korean giant is having a tough time when it comes to securing the major industry players, such as the likes of NVIDIA, due to which Samsung has revealed that their Q3 2024 earning guidance would come in below market expectations. While there are several factors accounting for the reason behind this "economic downfall", Samsung's late entry into the AI markets, coupled with growing competition from the likes of SK hynix and TSMC, has pushed back the Korean giant, which they have admitted in a post addressing the general public.
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Samsung says that they failed to secure a significant AI "anonymous" customer (via Reuters). While they didn't give us any names, the leading candidate is none other than NVIDIA, given the track record of developments we witnessed with NVIDIA and Samsung collaborating for an HBM partnership.

The Korean giant hasn't explicitly confirmed this, but based on what the firm claims, it looks like NVIDIA has pushed Samsung off the list. Samsung says the supply of high-end HBM3E AI chips has been delayed, putting them far behind the competition.
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Not only this, but Samsung claims that the supply of traditional semiconductors from Chinese firms has hindered the company's business. Currently, the production capacity of China's semiconductor industry has grown massively, which has attracted companies looking to acquire lower-margin chips but in higher quantities. So, Samsung has seen a hit in this segment as well, which is why the firm's foundry business has been hit massively.

However, Samsung isn't expecting to undergo "radical" changes. In a recent statement by Chairperson Jay Y. Lee, the Korean firm won't spin off the foundry business but will continue to be indulged in the race. Right now, Samsung is faced with severe issues, including ineffective 3nm yields and troubles in the production of next-gen processes. Hence, the foundry division isn't really in the best of position for now.
 
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