Generally, each new generation of process technologies will feature incompatible design rules with the prior generations and design rules between different foundries with comparable technologies are likely incompatible as well. In IC design, you would only be able to reuse the RTL code between the different physical design implementations across the targeted set of process technologies ...The rumored T239 chip is based on the Orin SoC that is manufactured on the 8nm process, correct? Hypothetically speaking, what would be the R&D costs to adapt the design to a different process?