DmitryKo
Veteran
I'm not really sure why you have to dispute official datasheets - is it so hard to believe that 6-core Kaby Lake can have a peak current of ~140 A when 4-core processors are specified for 100 A?
Datasheets for server/workstation and HEDT processors have a few more details, such as duration of peak currents, permitted voltage drop and maximum package power - look up "DC Specifications" section. (Note that these CPUs do not have integrated graphics, so voltages/currents are for the processor cores.)
Skylake-X (LGA2066)
https://www.intel.com/content/www/u...rs/core/6th-gen-x-series-datasheet-vol-1.html
6-, 8-, 10-, 12-core processors (TDP 140 W) with Integrated VR 13.0
Nominal voltage (VCCIN) 1.8 V
Sustained current (ICCIN_TDC) 73 A
Can draw maximum current (ICCIN_MAX) of 190 A (with transient tolerance -0.19 V and maximum power 297 W) for up to 2 ms
Broadwell-EP (LGA2011-v3)
https://www.intel.com/content/www/us/en/processors/xeon/xeon-e5-v4-datasheet-vol-1.html
4-,6- and 8-core processors (TDP 140 W) with Integrated VR 12.5
Nominal voltage (VCCIN) 1.82 V
Sustained current (ICCIN_TDC) 80 A
Can draw maximum current (ICCIN_MAX) of 170 A (with transient tolerance -0.179 V and maximum power 280 W) for up to 4 ms
Haswell-E (LGA2011-v3)
https://www.intel.com/content/www/us/en/processors/core/core-i7-lga2011-3-datasheet-vol-1.html
6- and 8-core processors (TDP 140 W) with Integrated VR 12.5
Nominal voltage (VCCIN) 1.8 V
Sustained current (ICCIN_TDC) 82 A
Can draw maximum current (ICCIN_MAX) of 175 A (with transient tolerance -0.2 V and maximum power 270 W) for up to 4 ms
Haswell-EX (LGA2011-1)
https://www.intel.com/content/www/us/en/processors/xeon/xeon-e7-v3-datasheet-vol-1.html
4-, 6-, 8- core processors (TDP 115/140 W) with integrated EVRD 12.5
Operating voltage (VCC) 1.5 - 1.8 V
Sustained current (ICC_TDC) 71/86 A
Can draw maximum current (ICC_MAX) of 165/201 A (with transient tolerance -0.132/-0.16 V) for up to 2 ms, followed by a fall-down to (ICC_TDC+ICC_MAX)/2 for 14 ms, for a total of 10 s
Heat sink should withstand 1.2xTDP
Ivy Bridge-EX (LGA2011-1)
https://www.intel.com/content/www/us/en/processors/xeon/xeon-e7-v2-datasheet-vol-1.html
6-,8-,10-,12- core processors (TDP 105/130 W) with external VR 12.0
Operating voltage (VCC VID) 0.6 - 1.25 V
Sustained current (ICC_TDC) 115/140 A
Can draw maximum current (ICC_MAX) of 165/190 A (with transient tolerance -0.092/-0.152 V) for up to 3 ms. followed by a fall-down to (ICC_TDC+ICC_MAX)/2 for 9 ms, for a total of 10 s
Heat sink should withstand 1.2xTDP
Sandy Bridge-E (LGA2011)
https://www.intel.com/content/www/us/en/processors/core/4th-gen-core-i7-lga2011-datasheet-vol-1.html
4- and 6-core processors (TDP 140 W) with external VR 12.0
Operating voltage (VCC VID) 0.65 - 1.35 V
Sustained current (ICC_TDC) 135 A
Can draw maximum current (ICC _MAX) of 165 A for 5 s, followed for a fall-down to ICC_TDC in 20 s
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TDC (Thermal Design Current) is "the sustained (DC equivalent) current that the processor is capable of drawing indefinitely and should be used for the voltage regulator thermal assessment."
TDP (Thermal Design Power) is "the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload."
Datasheets for server/workstation and HEDT processors have a few more details, such as duration of peak currents, permitted voltage drop and maximum package power - look up "DC Specifications" section. (Note that these CPUs do not have integrated graphics, so voltages/currents are for the processor cores.)
Skylake-X (LGA2066)
https://www.intel.com/content/www/u...rs/core/6th-gen-x-series-datasheet-vol-1.html
6-, 8-, 10-, 12-core processors (TDP 140 W) with Integrated VR 13.0
Nominal voltage (VCCIN) 1.8 V
Sustained current (ICCIN_TDC) 73 A
Can draw maximum current (ICCIN_MAX) of 190 A (with transient tolerance -0.19 V and maximum power 297 W) for up to 2 ms
Broadwell-EP (LGA2011-v3)
https://www.intel.com/content/www/us/en/processors/xeon/xeon-e5-v4-datasheet-vol-1.html
4-,6- and 8-core processors (TDP 140 W) with Integrated VR 12.5
Nominal voltage (VCCIN) 1.82 V
Sustained current (ICCIN_TDC) 80 A
Can draw maximum current (ICCIN_MAX) of 170 A (with transient tolerance -0.179 V and maximum power 280 W) for up to 4 ms
Haswell-E (LGA2011-v3)
https://www.intel.com/content/www/us/en/processors/core/core-i7-lga2011-3-datasheet-vol-1.html
6- and 8-core processors (TDP 140 W) with Integrated VR 12.5
Nominal voltage (VCCIN) 1.8 V
Sustained current (ICCIN_TDC) 82 A
Can draw maximum current (ICCIN_MAX) of 175 A (with transient tolerance -0.2 V and maximum power 270 W) for up to 4 ms
Haswell-EX (LGA2011-1)
https://www.intel.com/content/www/us/en/processors/xeon/xeon-e7-v3-datasheet-vol-1.html
4-, 6-, 8- core processors (TDP 115/140 W) with integrated EVRD 12.5
Operating voltage (VCC) 1.5 - 1.8 V
Sustained current (ICC_TDC) 71/86 A
Can draw maximum current (ICC_MAX) of 165/201 A (with transient tolerance -0.132/-0.16 V) for up to 2 ms, followed by a fall-down to (ICC_TDC+ICC_MAX)/2 for 14 ms, for a total of 10 s
Heat sink should withstand 1.2xTDP
Ivy Bridge-EX (LGA2011-1)
https://www.intel.com/content/www/us/en/processors/xeon/xeon-e7-v2-datasheet-vol-1.html
6-,8-,10-,12- core processors (TDP 105/130 W) with external VR 12.0
Operating voltage (VCC VID) 0.6 - 1.25 V
Sustained current (ICC_TDC) 115/140 A
Can draw maximum current (ICC_MAX) of 165/190 A (with transient tolerance -0.092/-0.152 V) for up to 3 ms. followed by a fall-down to (ICC_TDC+ICC_MAX)/2 for 9 ms, for a total of 10 s
Heat sink should withstand 1.2xTDP
Sandy Bridge-E (LGA2011)
https://www.intel.com/content/www/us/en/processors/core/4th-gen-core-i7-lga2011-datasheet-vol-1.html
4- and 6-core processors (TDP 140 W) with external VR 12.0
Operating voltage (VCC VID) 0.65 - 1.35 V
Sustained current (ICC_TDC) 135 A
Can draw maximum current (ICC _MAX) of 165 A for 5 s, followed for a fall-down to ICC_TDC in 20 s
---
TDC (Thermal Design Current) is "the sustained (DC equivalent) current that the processor is capable of drawing indefinitely and should be used for the voltage regulator thermal assessment."
TDP (Thermal Design Power) is "the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload."
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